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IS66WVE409616BLL-70BLI PDF预览

IS66WVE409616BLL-70BLI

更新时间: 2024-11-14 14:51:39
品牌 Logo 应用领域
美国芯成 - ISSI 内存集成电路
页数 文件大小 规格书
30页 673K
描述
Pseudo Static RAM, 4MX16, 70ns, CMOS, PBGA48, 6 X 8 MM, MO-207, TFBGA-48

IS66WVE409616BLL-70BLI 技术参数

生命周期:Active包装说明:6 X 8 MM, MO-207, TFBGA-48
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.67
Is Samacsys:N最长访问时间:70 ns
JESD-30 代码:R-PBGA-B48长度:8 mm
内存密度:67108864 bit内存集成电路类型:PSEUDO STATIC RAM
内存宽度:16功能数量:1
端子数量:48字数:4194304 words
字数代码:4000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:4MX16封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:0.75 mm
端子位置:BOTTOM宽度:6 mm
Base Number Matches:1

IS66WVE409616BLL-70BLI 数据手册

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IS66WVE409616BLL  
Advanced Information  
3.0V Core Async/Page PSRAM  
Overview  
The IS66WVE409616BLL is an integrated memory device containing 64Mbit Pseudo Static Random Access  
Memory using a self-refresh DRAM array organized as 4M words by 16 bits. The device includes several  
power saving modes : Partial Array Refresh mode where data is retained in a portion of the array and  
Deep Power Down mode. Both these modes reduce standby current drain. The die has separate power  
rails, VDDQ and VSSQ for the I/O to be run from a separate power supply from the device core.  
Features  
z Asynchronous and page mode interface  
z Low Power Feature  
z Dual voltage rails for optional performance  
y VDD 2.7V~3.6V, VDDQ 2.7V~3.6V  
z Page mode read access  
y Interpage Read access : 70ns  
y Intrapage Read access : 20ns  
z Low Power Consumption  
y Temperature Controlled Refresh  
y Partial Array Refresh  
y Deep power-down (DPD) mode  
z Operating temperature Range  
Industrial -40°C~85°C  
z Packages:  
48-ball TFBGA, 48-pin TSOP-I  
y Asynchronous Operation < 30 mA  
y Intrapage Read < 18mA  
y Standby < 180 uA (max.)  
y Deep power-down (DPD) < 3uA (Typ)  
Copyright © 2010 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its  
products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services  
described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information  
and before placing orders for products.  
1
www.issi.com - SRAM@issi.com  
Rev.00B | February 2010  

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