是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | TFBGA, BGA48,6X8,30 | Reach Compliance Code: | compliant |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.76 |
最长访问时间: | 70 ns | I/O 类型: | COMMON |
JESD-30 代码: | R-PBGA-B48 | JESD-609代码: | e1 |
长度: | 8 mm | 内存密度: | 67108864 bit |
内存集成电路类型: | PSEUDO STATIC RAM | 内存宽度: | 16 |
功能数量: | 1 | 端口数量: | 1 |
端子数量: | 48 | 字数: | 4194304 words |
字数代码: | 4000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 4MX16 | 输出特性: | 3-STATE |
可输出: | NO | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装等效代码: | BGA48,6X8,30 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 260 |
反向引出线: | NO | 座面最大高度: | 1.2 mm |
最大待机电流: | 0.00015 A | 最小待机电流: | 1.7 V |
最大压摆率: | 0.025 mA | 最大供电电压 (Vsup): | 1.95 V |
最小供电电压 (Vsup): | 1.7 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.75 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 10 | 宽度: | 6 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
IS66WVE4M16TBLL-55BLI | ISSI |
获取价格 |
Pseudo Static RAM, 4MX16, 55ns, CMOS, PBGA48, 6 X 8 MM, LEAD FREE, MO-207, TFBGA-48 | |
IS66WVE4M16TBLL-70BLI | ISSI |
获取价格 |
Pseudo Static RAM, 4MX16, 70ns, CMOS, PBGA48, 6 X 8 MM, LEAD FREE, MO-207, TFBGA-48 | |
IS66WVE4M16TBLL-70BLI-TR | ISSI |
获取价格 |
Pseudo Static RAM, | |
IS66WVE51216BLL | ISSI |
获取价格 |
Asynchronous and page mode interface | |
IS66WVE51216CLL | ISSI |
获取价格 |
Asynchronous and page mode interface | |
IS66WVE51216EALL | ISSI |
获取价格 |
Asynchronous and page mode interface | |
IS66WVH8M8ALL-166B1LI | ISSI |
获取价格 |
Pseudo Static RAM, 8MX8, CMOS, PBGA24, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA- | |
IS66WVH8M8BLL-100B1LI | ISSI |
获取价格 |
Pseudo Static RAM, 8MX8, CMOS, PBGA24, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA- | |
IS66WVO16M8EDALL-100BLA2 | ISSI |
获取价格 |
SRAM, | |
IS66WVO16M8EDALL-100BLI | ISSI |
获取价格 |
SRAM, |