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IS61WV2568EDBLL-10BI PDF预览

IS61WV2568EDBLL-10BI

更新时间: 2024-11-13 00:56:23
品牌 Logo 应用领域
美国芯成 - ISSI 静态存储器内存集成电路
页数 文件大小 规格书
14页 657K
描述
256K x 8 HIGH SPEED ASYNCHRONOUS CMOS STATIC RAM WITH ECC

IS61WV2568EDBLL-10BI 技术参数

是否Rohs认证: 不符合生命周期:Active
零件包装代码:DSBGA包装说明:TFBGA, BGA36,6X8,30
针数:36Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.5最长访问时间:10 ns
其他特性:PIPELINED ARCHITECTUREI/O 类型:COMMON
JESD-30 代码:R-PBGA-B36JESD-609代码:e0
长度:8 mm内存密度:2097152 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
功能数量:1端子数量:36
字数:262144 words字数代码:256000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:256KX8
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装等效代码:BGA36,6X8,30
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:2.5/3.3 V认证状态:Not Qualified
座面最大高度:1.2 mm最大待机电流:0.006 A
最小待机电流:2 V子类别:SRAMs
最大压摆率:0.035 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.4 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:TIN LEAD
端子形式:BALL端子节距:0.75 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:6 mm

IS61WV2568EDBLL-10BI 数据手册

 浏览型号IS61WV2568EDBLL-10BI的Datasheet PDF文件第2页浏览型号IS61WV2568EDBLL-10BI的Datasheet PDF文件第3页浏览型号IS61WV2568EDBLL-10BI的Datasheet PDF文件第4页浏览型号IS61WV2568EDBLL-10BI的Datasheet PDF文件第5页浏览型号IS61WV2568EDBLL-10BI的Datasheet PDF文件第6页浏览型号IS61WV2568EDBLL-10BI的Datasheet PDF文件第7页 
IS61WV2568EDBLL  
IS64WV2568EDBLL  
256K x 8 HIGH SPEED ASYNCHRONOUS  
CMOS STATIC RAM WITH ECC  
DECEMBER 2011  
DESCRIPTION  
FEATURES  
Theꢀ ISSIꢀ IS61/64WV2568EDBLLꢀ isꢀ aꢀ ꢀ high-speed,ꢀ  
2,097,152-bitꢀstaticꢀRAMsꢀorganizedꢀasꢀ262,144ꢀwordsꢀbyꢀ  
8bits.ItisfabricatedusingISSI'shigh-performanceCMOSꢀ  
technology.ꢀThisꢀhighlyꢀreliableꢀprocessꢀcoupledꢀwithꢀinno-  
vativeꢀcircuitꢀdesignꢀtechniques,ꢀyieldsꢀhigh-performanceꢀ  
andꢀlowꢀpowerꢀconsumptionꢀdevices.  
•ꢀ High-speedꢀaccessꢀtime:ꢀ8,ꢀ10ꢀns  
•ꢀ LowꢀActiveꢀPower:ꢀ85ꢀmWꢀ(typical)  
•ꢀ LowꢀStandbyꢀPower:ꢀ7ꢀmWꢀ(typical)ꢀ  
CMOSꢀstandby  
•ꢀ Singleꢀpowerꢀsupply  
ꢀ —ꢀꢀVddꢀ2.4Vꢀtoꢀ3.6Vꢀ(10ꢀns)  
—ꢀꢀVddꢀ3.3Vꢀ ꢀ10%ꢀ(8ꢀns)  
WhenCEisHIGH(deselected),thedeviceassumesaꢀ  
standbyꢀmodeꢀatꢀwhichꢀtheꢀpowerꢀdissipationꢀcanꢀbeꢀre-  
ducedꢀdownꢀwithꢀCMOSꢀinputꢀlevels.  
•ꢀ Fullyꢀstaticꢀoperation:ꢀnoꢀclockꢀorꢀrefreshꢀꢀ  
required  
EasymemoryexpansionꢀisꢀprovidedꢀbyꢀusingꢀChipꢀEnableꢀ  
andꢀOutputꢀEnableꢀinputs,ꢀCEꢀandꢀOE.ꢀTheꢀactiveꢀLOWꢀ  
WriteEnable(WE)controlsbothwritingandreadingofꢀ  
theꢀmemory.ꢀꢀ  
•ꢀ Threeꢀstateꢀoutputs  
•ꢀ IndustrialꢀandꢀAutomotiveꢀtemperatureꢀsupport  
•ꢀ Lead-freeꢀavailable  
•ꢀ ErrorꢀDetectionꢀandꢀErrorꢀCorrection  
TheꢀIS61/64WV2568EDBLLꢀisꢀꢀpackagedꢀinꢀtheꢀJEDECꢀ  
standard44-pinTSOP-II,36-pinSOJand36-pinMiniBGAꢀ  
(6mmꢀxꢀ8mm).  
FUNCTIONAL BLOCK DIAGRAM  
ECC Array  
(256Kx4)  
Memory Array  
(256Kx8)  
A0-A17  
Decoder  
8
4
8
8
12  
I/O Data  
Circuit  
ECC  
IO0-7  
Column I/O  
/CE  
/OE  
/WE  
Control  
Circuit  
Copyrightꢀ©ꢀ2011ꢀIntegratedꢀSiliconꢀSolution,ꢀInc.ꢀꢀAllꢀrightsꢀreserved.ꢀꢀISSIꢀreservesꢀtheꢀrightꢀtoꢀmakeꢀchangesꢀtoꢀthisꢀspecificationꢀandꢀitsꢀproductsꢀatꢀanyꢀtimeꢀwithoutꢀ  
notice.ꢀꢀꢀISSIꢀassumesꢀnoꢀliabilityꢀarisingꢀoutꢀofꢀtheꢀapplicationꢀorꢀuseꢀofꢀanyꢀinformation,ꢀproductsꢀorꢀservicesꢀdescribedꢀherein.ꢀCustomersꢀareꢀadvisedꢀtoꢀobtainꢀtheꢀlat-  
estꢀversionꢀofꢀthisꢀdeviceꢀspecificationꢀbeforeꢀrelyingꢀonꢀanyꢀpublishedꢀinformationꢀandꢀbeforeꢀplacingꢀordersꢀforꢀproducts.  
IntegratedꢀSiliconꢀSolution,ꢀInc.ꢀdoesꢀnotꢀrecommendꢀtheꢀuseꢀofꢀanyꢀofꢀitsꢀproductsꢀinꢀlifeꢀsupportꢀapplicationsꢀwhereꢀtheꢀfailureꢀorꢀmalfunctionꢀofꢀtheꢀproductꢀcanꢀreason-  
ablyꢀbeꢀexpectedꢀtoꢀcauseꢀfailureꢀofꢀtheꢀlifeꢀsupportꢀsystemꢀorꢀtoꢀsignificantlyꢀaffectꢀitsꢀsafetyꢀorꢀeffectiveness.ꢀProductsꢀareꢀnotꢀauthorizedꢀforꢀuseꢀinꢀsuchꢀapplicationsꢀ  
unlessꢀIntegratedꢀSiliconꢀSolution,ꢀInc.ꢀreceivesꢀwrittenꢀassuranceꢀtoꢀitsꢀsatisfaction,ꢀthat:  
a.)ꢀtheꢀriskꢀofꢀinjuryꢀorꢀdamageꢀhasꢀbeenꢀminimized;  
b.)ꢀtheꢀuserꢀassumeꢀallꢀsuchꢀrisks;ꢀand  
c.)ꢀpotentialꢀliabilityꢀofꢀIntegratedꢀSiliconꢀSolution,ꢀIncꢀisꢀadequatelyꢀprotectedꢀunderꢀtheꢀcircumstancesꢀꢀ  
Integrated Silicon Solution, Inc. — www.issi.comꢀ  
1
Rev. A  
11/08/2011  

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