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IS61WV51232ALL PDF预览

IS61WV51232ALL

更新时间: 2024-09-24 12:04:03
品牌 Logo 应用领域
美国芯成 - ISSI /
页数 文件大小 规格书
19页 177K
描述
512K x 32 HIGH-SPEED ASYNCHRONOUS CMOS STATIC RAM WITH 3.3V SUPPLY

IS61WV51232ALL 数据手册

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IS61WV51232ALL/ALS  
IS61WV51232BLL/BLS  
IS64WV51232BLL/BLS  
512K x 32 HIGH-SPEED ASYNCHRONOUS  
CMOS STATIC RAM WITH 3.3V SUPPLY  
PRELIMINARYINFORMATION  
APRIL2008  
FEATURES  
• High-speed access times:  
8, 10, 20 ns  
• High-performance, low-power CMOS process  
• Multiple center power and ground pins for greater  
noise immunity  
DESCRIPTION  
The ISSI IS61WV51232Axx/Bxx and IS64WV51232Bxx  
are high-speed, 16M-bit static RAMs organized as 512K  
words by 32 bits. It is fabricated using ISSI's high-perform-  
anceCMOStechnology.Thishighlyreliableprocesscoupled  
withinnovativecircuitdesigntechniques,yieldshigh-perfor-  
mance and low power consumption devices.  
• Easy memory expansion with CE and OE op-  
tions  
CE power-down  
• Fully static operation: no clock or refresh  
required  
When CE is HIGH (deselected), the device assumes a  
standby mode at which the power dissipation can be  
reduced down with CMOS input levels.  
Easy memory expansion is provided by using Chip Enable  
and Output Enable inputs, CE and OE. The active LOW  
Write Enable (WE) controls both writing and reading of the  
memory.  
• TTL compatible inputs and outputs  
• Single power supply  
VDD 1.65V to 2.2V (IS61WV51232Axx)  
speed = 20ns for VDD 1.65V to 2.2V  
VDD 2.4V to 3.6V (IS61/64WV51232Bxx)  
speed = 10ns for VDD 2.4V to 3.6V  
speed = 8ns for VDD 3.3V + 5%  
• Packages available:  
ThedeviceispackagedintheJEDECstandard90-ball BGA  
(8mm x 13mm).  
90-ball miniBGA (8mm x 13mm)  
• Industrial and Automotive Temperature Support  
• Lead-free available  
FUNCTIONAL BLOCK DIAGRAM  
512K x 32  
MEMORY ARRAY  
A0-A18  
DECODER  
VDD  
VSS  
DQa-d  
I/O  
COLUMN I/O  
DATA  
CIRCUIT  
CE  
OE  
WE  
CONTROL  
CIRCUIT  
BWa-d  
CE2  
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time  
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to  
obtain the latest version of this device specification before relying on any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. — www.issi.com  
1
Rev. 00B  
04/23/08  

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