IS43/46DR86400C
IS43/46DR16320C
64Mx8, 32Mx16 DDR2 DRAM
FEATURES
•ꢀ Vdd = 1.8V 0.1V, Vddq = 1.8V 0.1V
MARCH 2013
DESCRIPTION
ISSI's 512Mb DDR2 SDRAM uses a double-data-rate
architecture to achieve high-speed operation. The
double-data rate architecture is essentially a 4n-prefetch
architecture, with an interface designed to transfer two
data words per clock cycle at the I/O balls.
•ꢀ JEDEC standard 1.8V I/O (SSTL_18-compatible)
•ꢀ Double data rate interface: two data transfers
per clock cycle
•ꢀ Differential data strobe (DQS, DQS)
•ꢀ 4-bit prefetch architecture
•ꢀ On chip DLL to align DQ and DQS transitions
ADDRESS TABLE
with CK
Parameter
64M x 8
32M x 16
•ꢀ 4 internal banks for concurrent operation
•ꢀ Programmable CAS latency (CL) 3, 4, 5, and 6
Configuration
16M x 8 x 4
8M x 16 x 4
banks
banks
supported
Refresh Count
8K/64ms
8K/64ms
•ꢀ Posted CAS and programmable additive latency
Row Addressing 16K (A0-A13) 8K (A0-A12)
(AL) 0, 1, 2, 3, 4, and 5 supported
•ꢀ WRITE latency = READ latency - 1 tCK
•ꢀ Programmable burst lengths: 4 or 8
Column
1K (A0-A9)
1K (A0-A9)
Addressing
Bank Addressing BA0, BA1
BA0, BA1
A10
•ꢀ Adjustable data-output drive strength, full and
Precharge
Addressing
A10
reduced strength options
•ꢀ On-die termination (ODT)
KEY TIMING PARAMETERS
OPTIONS
•ꢀ Configuration(s):
Speed Grade
-25D -3D
64Mx8 (16Mx8x4 banks) IS43/46DR86400C
32Mx16 (8Mx16x4 banks) IS43/46DR16320C
•ꢀ Package:
tRCD
12.5
12.5
55
15
15
55
40
5
tRP
tRC
x8: 60-ball BGA (8mm x 10.5mm)
x16: 84-ball WBGA (8mm x 12.5mm)
Timing – Cycle time
2.5ns @CL=5 DDR2-800D
2.5ns @CL=6 DDR2-800E
3.0ns @CL=5 DDR2-667D
3.75ns @CL=4 DDR2-533C
tRAS
40
tCK @CL=3
tCK @CL=4
tCK @CL=5
tCK @CL=6
5
3.75 3.75
2.5
2.5
3
—
5ns @CL=3 DDR2-400B
•ꢀ Temperature Range:
Commercial (0°C ≤ Tc ≤ 85°C)
Industrial (-40°C ≤ Tc ≤ 95°C; -40°C ≤ Ta ≤ 85°C)
Automotive, A1 (-40°C ≤ Tc ≤ 95°C; -40°C ≤ Ta ≤ 85°C)
Automotive, A2 (-40°C ≤ Tc; Ta ≤ 105°C)
Tc = Case Temp, Ta = Ambient Temp
Copyright © 2013 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest
version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reason-
ably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications
unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. — www.issi.com
1
Rev. A
3/19/2013