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IS43LD16320A PDF预览

IS43LD16320A

更新时间: 2024-11-25 01:20:19
品牌 Logo 应用领域
美国芯成 - ISSI 双倍数据速率
页数 文件大小 规格书
143页 6857K
描述
Four-bit Pre-fetch DDR Architecture

IS43LD16320A 数据手册

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IS43/46LD16320A  
IS43/46LD32160A  
512Mb (x16, x32) Mꢁbꢂle LpddR2 s4 sdRAMAdVAnCꢀd inFoRMAtion  
AUGUst 2014  
FꢀAtURꢀs  
dꢀsCRiption  
The IS43/46LD16320A/32160A is 512Mbit CMOS  
LPDDR2 DRAM. The device is organized as 4 banks  
of 8Meg words of 16bits or 4Meg words of 32bits.  
This product uses a double-data-rate architecture to  
achieve high-speed operation. The double data rate  
architecture is essentially a 4N prefetch architecture  
with an interface designed to transfer two data words  
per clock cycle at the I/O pins. This product offers fully  
synchronous operations referenced to both rising and  
falling edges of the clock. The data paths are internally  
pipelined and 4n bits prefetched to achieve very high  
bandwidth.  
•ꢀ Low-voltage Core and I/O Power Supplies  
VDD2 = 1.14-1.30V, VDDCA/VDDQ = 1.14-1.30V,  
VDD1 = 1.70-1.95V  
•ꢀ High Speed Un-terminated Logic(HSUL_12) I/O  
Interface  
•ꢀ Clock Frequency Range : 10MHz to 533MHz  
(data rate range : 20Mbps to 1066Mbps per I/O)  
•ꢀ Four-bit Pre-fetch DDR Architecture  
•ꢀ Multiplexed, double data rate, command/ad-  
dress inputs  
•ꢀ Four internal banks for concurrent operation  
•ꢀ Bidirectional/differential data strobe per byte of  
data (DQS/DQS#)  
•ꢀ Programmable Read/Write latencies(RL/WL)  
AddRꢀss tABLꢀ  
Parameter  
and burst lengths(4,8 or 16)  
16Mx32  
R0-R12  
C0-C8  
32Mx16  
R0-R12  
C0-C9  
•ꢀ ZQ Calibration  
Row Addresses  
Column Addresses  
Bank Addresses  
Refresh Count  
•ꢀ On-chip temperature sensor to control self re-  
fresh rate  
BA0-BA1 BA0-BA1  
•ꢀ Partial –array self refresh(PASR)  
•ꢀ Deep power-down mode(DPD)  
4096  
4096  
•ꢀ Operation Temperature  
Commercial (TC = 0°C to 85°C)  
Industrial (TC = -40°C to 85°C)  
kꢀY tiMinG pARAMꢀtꢀRs  
Speed  
Grade  
Data  
Rate  
Write  
Read tRCD/  
Automotive, A1 (T  
Automotive, A2 (T  
C
= -40°C to 85°C)  
= -40°C to 105°C)  
C
Latency Latency tRP  
(Mb/s)  
options  
•ꢀ Configuration:  
-18  
-25  
-3  
1066  
800  
4
3
2
8
6
5
Typical  
Typical  
Typical  
− 32Mx16 (8M x 16 x 4 banks)  
− 16Mx32 (4M x 32 x 4 banks)  
Package:  
− 134-ball BGA for x16 / x32  
− 168-ball PoP BGA for x32  
667  
Note: Other clock frequencies/data rates supported; please  
refer to AC timing tables.  
Copyright © 2014 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no  
liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on  
any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be ex-  
pected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon  
Solution, Inc. receives written assurance to its satisfaction, that:  
a.) the risk of injury or damage has been minimized;  
b.) the user assume all such risks; and  
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances  
Integrated Silicon Solution, Inc. — www.issi.com  
1
Rev. 00C  
8/11/2014  

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