Datasheet > IS43LD16160A

IS43LD16160A

更新时间： 2024-11-28 01:20:19

品牌	Logo	应用领域
美国芯成 - ISSI		/
页数	文件大小	规格书
143页	6891K
描述
Four internal banks for concurrent operation

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数据手册

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IS43LD16160A 数据手册

IS43/46LD16160A

IS43/46LD32800A

256Mb (x16, x32) Mꢁbꢂle LpddR2 s4 sdRAM_{AdVAncꢀd inFoRMAtion}

AUGUst 2014

FꢀAtURꢀs

dꢀscRiption

The IS43/46LD16160A/32800A is 256Mbit CMOS

LPDDR2 DRAM. The device is organized as 4 banks

of 4Meg words of 16bits or 2Meg words of 32bits.

This product uses a double-data-rate architecture to

achieve high-speed operation. The double data rate

architecture is essentially a 4N prefetch architecture

with an interface designed to transfer two data words

per clock cycle at the I/O pins. This product offers fully

synchronous operations referenced to both rising and

falling edges of the clock. The data paths are internally

pipelined and 4n bits prefetched to achieve very high

bandwidth.

•ꢀ Low-voltage Core and I/O Power Supplies

VDD2 = 1.14-1.30V, VDDCA/VDDQ = 1.14-1.30V,

VDD1 = 1.70-1.95V

•ꢀ High Speed Un-terminated Logic(HSUL_12) I/O

Interface

•ꢀ Clock Frequency Range : 10MHz to 533MHz

(data rate range : 20Mbps to 1066Mbps per I/O)

•ꢀ Four-bit Pre-fetch DDR Architecture

•ꢀ Multiplexed, double data rate, command/ad-

dress inputs

•ꢀ Four internal banks for concurrent operation

•ꢀ Bidirectional/differential data strobe per byte of

data (DQS/DQS#)

•ꢀ Programmable Read/Write latencies(RL/WL)

AddRꢀss tABLꢀ

Parameter

and burst lengths(4,8 or 16)

8Mx32

R0-R12

C0-C7

16Mx16

R0-R12

C0-C8

•ꢀ ZQ Calibration

Row Addresses

Column Addresses

Bank Addresses

Refresh Count

•ꢀ On-chip temperature sensor to control self re-

fresh rate

BA0-BA1 BA0-BA1

•ꢀ Partial –array self refresh(PASR)

•ꢀ Deep power-down mode(DPD)

4096

•ꢀ Operation Temperature

Commercial (TC = 0°C to 85°C)

Industrial (TC = -40°C to 85°C)

kꢀY tiMinG pARAMꢀtꢀRs

Speed

Grade

Data

Rate

Write

Read tRCD/

Automotive, A1 (T

Automotive, A2 (T

= -40°C to 85°C)

= -40°C to 105°C)

Latency Latency tRP

(Mb/s)

options

•ꢀ Conﬁguration:

-18

-25

-3

1066

800

Typical

− 16Mx16 (4M x 16 x 4 banks)

− 8Mx32 (2M x 32 x 4 banks)

Package:

− 134-ball BGA for x16 / x32

− 168-ball PoP BGA for x32

667

Note: Other clock frequencies/data rates supported; please

refer to AC timing tables.

liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device speciﬁcation before relying on

any published information and before placing orders for products.

Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be ex-

pected to cause failure of the life support system or to signiﬁcantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon

Solution, Inc. receives written assurance to its satisfaction, that:

a.) the risk of injury or damage has been minimized;

b.) the user assume all such risks; and

c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances

Integrated Silicon Solution, Inc. — www.issi.com

Rev. 00B

8/11/2014

12 3 4 5 6 7...143

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IS43LD16640A-25BL-TR	ISSI	获取价格	IC DRAM 1G PARALLEL 134TFBGA
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