IRLR014, IRLU014, SiHLR014, SiHLU014
Vishay Siliconix
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
PRODUCT SUMMARY
VDS (V)
60
Available
• Surface Mount (IRLR014/SiHLR014)
0.20
RDS(on) (Ω)
Qg (Max.) (nC)
Qgs (nC)
VGS = 5.0 V
RoHS*
• Straight Lead (IRLU014/SiHLU014)
8.4
3.5
COMPLIANT
• Available in Tape and Reel
• Logic-Level Gate Drive
• RDS(on) Specified at VGS = 4 V and 5 V
• Fast Switching
Q
gd (nC)
6.0
Configuration
Single
D
• Lead (Pb)-free Available
DPAK
(TO-252)
IPAK
(TO-251)
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
G
S
N-Channel MOSFET
lead version (IRFU/SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
ORDERING INFORMATION
Package
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
IRLR014TRLPbFa
SiHLR014TL-E3a
IRLR014TRLa
IPAK (TO-251)
IRLU014PbF
SiHLU014-E3
IRLU014
IRLR014PbF
SiHLR014-E3
IRLR014
IRLR014TRPbFa
SiHLR014T-E3a
IRLR014TRa
Lead (Pb)-free
SnPb
SiHLR014
SiHLR014Ta
SiHLR014TLa
SiHLU014
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
60
10
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
TC = 25 °C
TC =100°C
7.7
4.9
Continuous Drain Current
VGS at 5.0 V
ID
A
Pulsed Drain Currenta
IDM
31
Linear Derating Factor
0.20
0.020
47
W/°C
mJ
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
EAS
PD
T
C = 25 °C
25
W
TA = 25 °C
2.5
dV/dt
4.5
V/ns
°C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
TJ, Tstg
- 55 to + 150
260d
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, starting TJ = 25 °C, L = 924 µH, RG = 25 Ω, IAS = 7.7 A (see fig. 12).
c. ISD ≤ 10 A, dI/dt ≤ 90 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91321
S-Pending-Rev. A, 21-Jul-08
www.vishay.com
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