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IRLL014NPBF PDF预览

IRLL014NPBF

更新时间: 2024-10-02 03:36:39
品牌 Logo 应用领域
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页数 文件大小 规格书
9页 261K
描述
HEXFET Power MOSFET

IRLL014NPBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:LEAD FREE, SOT-223, 4 PINReach Compliance Code:not_compliant
ECCN代码:EAR99Factory Lead Time:20 weeks
风险等级:6.96Base Number Matches:1

IRLL014NPBF 数据手册

 浏览型号IRLL014NPBF的Datasheet PDF文件第2页浏览型号IRLL014NPBF的Datasheet PDF文件第3页浏览型号IRLL014NPBF的Datasheet PDF文件第4页浏览型号IRLL014NPBF的Datasheet PDF文件第5页浏览型号IRLL014NPBF的Datasheet PDF文件第6页浏览型号IRLL014NPBF的Datasheet PDF文件第7页 
PD- 95154  
IRLL014NPbF  
HEXFET® Power MOSFET  
l Surface Mount  
D
l Advanced Process Technology  
l Ultra Low On-Resistance  
l Dynamic dv/dt Rating  
l Fast Switching  
l Fully Avalanche Rated  
l Lead-Free  
VDSS = 55V  
RDS(on) = 0ꢀ14Ω  
G
ID = 2ꢀ0A  
S
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area" This benefit,  
combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well  
knownfor, providesthedesignerwithanextremelyefficient  
and reliable device for use in a wide variety of applications"  
The SOT-223 package is designed for surface-mount  
usingvaporphase, infrared, orwavesolderingtechniques"  
Its unique package design allows for easy automatic pick-  
and-place as with other SOT or SOIC packages but has  
the added advantage of improved thermal performance  
due to an enlarged tab for heatsinking" Power dissipation  
of 1"0W is possible in a typical surface mount application"  
SOT-223  
Absolute Maximum Ratings  
Parameter  
Maxꢀ  
2ꢀ8  
2ꢀ0  
1ꢀ6  
16  
Units  
ID @ TA = 25°C  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V**  
Continuous Drain Current, VGS @ 10V*  
Continuous Drain Current, VGS @ 10V*  
Pulsed Drain Current   
A
PD @TA = 25°C  
PD @TA = 25°C  
Power Dissipation (PCB Mount)**  
Power Dissipation (PCB Mount)*  
Linear Derating Factor (PCB Mount)*  
Gate-to-Source Voltage  
2ꢀ1  
1ꢀ0  
8ꢀ3  
± 16  
32  
W
W
mW/°C  
V
VGS  
EAS  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
IAR  
2ꢀ0  
0ꢀ1  
7ꢀ2  
EAR  
Repetitive Avalanche Energy*  
Peak Diode Recovery dv/dt ƒ  
Junction and Storage Temperature Range  
mJ  
V/ns  
°C  
dv/dt  
TJ, TSTG  
-55 to + 150  
Thermal Resistance  
Parameter  
Junction-to-Ambꢀ (PCB Mount, steady state)*  
Typꢀ  
90  
Maxꢀ  
120  
Units  
RθJA  
RθJA  
°C/W  
Junction-to-Ambꢀ (PCB Mount, steady state)**  
50  
60  
* When mounted on FR-4 board using minimum recommended footprintꢀ  
** When mounted on 1 inch square copper board, for comparison with other SMD devicesꢀ  
www.irf.com  
1
4/20/04  

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