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IRHYS67134CMPBF PDF预览

IRHYS67134CMPBF

更新时间: 2024-11-18 19:55:43
品牌 Logo 应用领域
英飞凌 - INFINEON 局域网开关脉冲晶体管
页数 文件大小 规格书
9页 190K
描述
Power Field-Effect Transistor, 19A I(D), 150V, 0.09ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-257AA, HERMETIC SEALED PACKAGE-3

IRHYS67134CMPBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:FLANGE MOUNT, R-XSFM-P3Reach Compliance Code:compliant
风险等级:5.7雪崩能效等级(Eas):67 mJ
外壳连接:ISOLATED配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:150 V最大漏极电流 (ID):19 A
最大漏源导通电阻:0.09 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-257AAJESD-30 代码:R-XSFM-P3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):76 A
表面贴装:NO端子形式:PIN/PEG
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRHYS67134CMPBF 数据手册

 浏览型号IRHYS67134CMPBF的Datasheet PDF文件第2页浏览型号IRHYS67134CMPBF的Datasheet PDF文件第3页浏览型号IRHYS67134CMPBF的Datasheet PDF文件第4页浏览型号IRHYS67134CMPBF的Datasheet PDF文件第5页浏览型号IRHYS67134CMPBF的Datasheet PDF文件第6页浏览型号IRHYS67134CMPBF的Datasheet PDF文件第7页 
PD-96930C  
2N7590T3  
RADIATION HARDENED  
POWER MOSFET  
THRU-HOLE (Low-Ohmic TO-257AA)  
IRHYS67134CM  
150V, N-CHANNEL  
TECHNOLOGY  
Product Summary  
Part Number  
Radiation Level RDS(on)  
ID  
IRHYS67134CM 100K Rads (Si) 0.09019A  
IRHYS63134CM 300K Rads (Si) 0.09019A  
Low-Ohmic  
TO-257AA  
International Rectifier’s R6TM technology provides  
superior power MOSFETs for space applications.  
These devices have improved immunity to Single  
Event Effect (SEE) and have been characterized for  
useful performance with Linear Energy Transfer  
(LET) up to 90MeV/(mg/cm2). Their combination of  
Features:  
n
n
n
n
n
n
n
n
n
n
n
Low RDS(on)  
Fast Switching  
Single Event Effect (SEE) Hardened  
Low Total Gate Charge  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Eyelets  
Electrically Isolated  
Light Weight  
ESD Rating: Class 2 per MIL-STD-750,  
Method 1020  
very low R  
and faster switching times reduces  
DS(on)  
power loss and increases power density in today’s  
high speed switching applications such as DC-DC  
converters and motor controllers. These devices  
retain all of the well established advantages of  
MOSFETs such as voltage control, ease of paralleling  
and temperature stability of electrical parameters.  
Pre-Irradiation  
Absolute Maximum Ratings  
Parameter  
Units  
I
@ V  
@ V  
= 12V, T = 25°C Continuous Drain Current  
19  
12  
D
D
GS  
GS  
C
A
I
= 12V, T = 100°C Continuous Drain Current  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
Linear Derating Factor  
76  
DM  
@ T = 25°C  
P
D
75  
W
W/°C  
V
C
0.6  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy Á  
Avalanche Current À  
±20  
67  
GS  
E
mJ  
A
AS  
I
19  
AR  
E
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
7.5  
mJ  
V/ns  
AR  
dv/dt  
7.8  
T
-55 to 150  
J
°C  
g
T
Storage Temperature Range  
STG  
Lead Temperature  
Weight  
300 (0.063 in. /1.6 mm from case for 10s)  
4.3 (Typical)  
For footnotes refer to the last page  
www.irf.com  
1
01/31/14  

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