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IRFW540ATM PDF预览

IRFW540ATM

更新时间: 2024-11-06 19:55:03
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 开关脉冲晶体管
页数 文件大小 规格书
7页 231K
描述
Power Field-Effect Transistor, 28A I(D), 100V, 0.052ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, D2PAK-3

IRFW540ATM 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:D2PAK包装说明:D2PAK-3
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.34
雪崩能效等级(Eas):523 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):28 A最大漏极电流 (ID):28 A
最大漏源导通电阻:0.052 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):3.8 W
最大脉冲漏极电流 (IDM):110 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFW540ATM 数据手册

 浏览型号IRFW540ATM的Datasheet PDF文件第2页浏览型号IRFW540ATM的Datasheet PDF文件第3页浏览型号IRFW540ATM的Datasheet PDF文件第4页浏览型号IRFW540ATM的Datasheet PDF文件第5页浏览型号IRFW540ATM的Datasheet PDF文件第6页浏览型号IRFW540ATM的Datasheet PDF文件第7页 
IRFW/I540A  
Advanced Power MOSFET  
FEATURES  
BVDSS = 100 V  
RDS(on) = 0.052 Ω  
ID = 28 A  
n Avalanche Rugged Technology  
n Rugged Gate Oxide Technology  
n Lower Input Capacitance  
n Improved Gate Charge  
n Extended Safe Operating Area  
n 175Operating Temperature  
n Lower Leakage Current : 10 μA (Max.) @ VDS = 100V  
n Lower RDS(ON) : 0.041 Ω (Typ.)  
D2-PAK  
I2-PAK  
2
1
1
2
3
3
1. Gate 2. Drain 3. Source  
Absolute Maximum Ratings  
Symbol  
Characteristic  
Drain-to-Source Voltage  
Value  
100  
28  
Units  
VDSS  
V
Continuous Drain Current (TC=25)  
Continuous Drain Current (TC=100)  
Drain Current-Pulsed  
ID  
A
19.8  
110  
±20  
523  
28  
IDM  
VGS  
EAS  
IAR  
A
V
Gate-to-Source Voltage  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
10.7  
6.5  
mJ  
V/ns  
W
*
Total Power Dissipation (TA=25)  
Total Power Dissipation (TC=25)  
Linear Derating Factor  
3.8  
PD  
107  
0.71  
W
W/℃  
Operating Junction and  
TJ , TSTG  
- 55 to +175  
300  
Storage Temperature Range  
Maximum Lead Temp. for Soldering  
Purposes, 1/8? from case for 5-seconds  
TL  
Thermal Resistance  
Symbol  
Characteristic  
Typ.  
Max.  
Units  
RθJC  
Junction-to-Case  
Junction-to-Ambient  
Junction-to-Ambient  
--  
--  
--  
1.4  
40  
RθJA  
RθJA  
*
/W  
62.5  
* When mounted on the minimum pad size recommended (PCB Mount).  
Rev. B1  
2001 Fairchild Semiconductor Corporation  
1

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