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IRFU210 PDF预览

IRFU210

更新时间: 2024-11-09 05:39:31
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
8页 2400K
描述
Power MOSFET

IRFU210 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TO-251AA包装说明:IN-LINE, R-PSIP-T3
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.19
其他特性:AVALANCHE RATED雪崩能效等级(Eas):130 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:200 V
最大漏极电流 (Abs) (ID):2.6 A最大漏极电流 (ID):2.6 A
最大漏源导通电阻:1.5 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-251AAJESD-30 代码:R-PSIP-T3
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):225极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):25 W最大脉冲漏极电流 (IDM):10 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFU210 数据手册

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IRFR210, IRFU210, SiHFR210, SiHFU210  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
200  
Available  
• Repetitive Avalanche Rated  
R
DS(on) (Ω)  
VGS = 10 V  
1.5  
RoHS*  
• Surface Mount (IRFR210/SiHFR210)  
• Straight Lead (IRFU210/SiHFU210)  
• Available in Tape and Reel  
• Fast Switching  
Qg (Max.) (nC)  
8.2  
1.8  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
4.5  
Configuration  
Single  
• Ease of Paralleling  
D
• Lead (Pb)-free Available  
DPAK  
(TO-252)  
IPAK  
(TO-251)  
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU/SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surface mount applications.  
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
IRFR210PbF  
SiHFR210-E3  
IRFR210  
DPAK (TO-252)  
DPAK (TO-252)  
IRFR210TRPbFa  
SiHFR210T-E3a  
IRFR210TRa  
DPAK (TO-252)  
IPAK (TO-251)  
IRFU210PbF  
SiHFU210-E3  
IRFU210  
IRFR210TRLPbFa  
SiHFR210TL-E3a  
IRFR210TRLa  
-
Lead (Pb)-free  
-
IRFR210TRRa  
SiHFR210TRa  
SnPb  
SiHFR210  
SiHFR210TLa  
SiHFR210Ta  
SiHFU210  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
200  
20  
V
VGS  
TC = 25 °C  
TC =100°C  
2.6  
Continuous Drain Current  
VGS at 10 V  
ID  
1.7  
A
Pulsed Drain Currenta  
IDM  
10  
Linear Derating Factor  
0.20  
0.020  
130  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Avalanche Currenta  
EAS  
IAR  
mJ  
A
2.7  
Repetitive Avalanche Energya  
EAR  
2.5  
mJ  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
TC = 25 °C  
25  
PD  
W
V/ns  
°C  
TA = 25 °C  
2.5  
dV/dt  
5.0  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 150  
260d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 28 mH, RG = 25 Ω, IAS = 2.6 A (see fig. 12).  
c. ISD 2.6 A, dI/dt 70 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91268  
S-81394-Rev. A, 21-Jul-08  
www.vishay.com  
1

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