IRFR210, IRFU210, SiHFR210, SiHFU210
Vishay Siliconix
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
PRODUCT SUMMARY
VDS (V)
200
Available
• Repetitive Avalanche Rated
R
DS(on) (Ω)
VGS = 10 V
1.5
RoHS*
• Surface Mount (IRFR210/SiHFR210)
• Straight Lead (IRFU210/SiHFU210)
• Available in Tape and Reel
• Fast Switching
Qg (Max.) (nC)
8.2
1.8
COMPLIANT
Q
Q
gs (nC)
gd (nC)
4.5
Configuration
Single
• Ease of Paralleling
D
• Lead (Pb)-free Available
DPAK
(TO-252)
IPAK
(TO-251)
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
G
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU/SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
S
N-Channel MOSFET
ORDERING INFORMATION
Package
DPAK (TO-252)
IRFR210PbF
SiHFR210-E3
IRFR210
DPAK (TO-252)
DPAK (TO-252)
IRFR210TRPbFa
SiHFR210T-E3a
IRFR210TRa
DPAK (TO-252)
IPAK (TO-251)
IRFU210PbF
SiHFU210-E3
IRFU210
IRFR210TRLPbFa
SiHFR210TL-E3a
IRFR210TRLa
-
Lead (Pb)-free
-
IRFR210TRRa
SiHFR210TRa
SnPb
SiHFR210
SiHFR210TLa
SiHFR210Ta
SiHFU210
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
200
20
V
VGS
TC = 25 °C
TC =100°C
2.6
Continuous Drain Current
VGS at 10 V
ID
1.7
A
Pulsed Drain Currenta
IDM
10
Linear Derating Factor
0.20
0.020
130
W/°C
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Avalanche Currenta
EAS
IAR
mJ
A
2.7
Repetitive Avalanche Energya
EAR
2.5
mJ
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
TC = 25 °C
25
PD
W
V/ns
°C
TA = 25 °C
2.5
dV/dt
5.0
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
TJ, Tstg
- 55 to + 150
260d
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 50 V, starting TJ = 25 °C, L = 28 mH, RG = 25 Ω, IAS = 2.6 A (see fig. 12).
c. ISD ≤ 2.6 A, dI/dt ≤ 70 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91268
S-81394-Rev. A, 21-Jul-08
www.vishay.com
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