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IRF9Z34LPBF PDF预览

IRF9Z34LPBF

更新时间: 2024-11-21 05:39:27
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
8页 2460K
描述
Power MOSFET

IRF9Z34LPBF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TO-262AA
包装说明:IN-LINE, R-PSIP-T3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.3
其他特性:HIGH RELIABILITY雪崩能效等级(Eas):370 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):18 A
最大漏极电流 (ID):18 A最大漏源导通电阻:0.14 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-262AA
JESD-30 代码:R-PSIP-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):88 W
最大脉冲漏极电流 (IDM):72 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON

IRF9Z34LPBF 数据手册

 浏览型号IRF9Z34LPBF的Datasheet PDF文件第2页浏览型号IRF9Z34LPBF的Datasheet PDF文件第3页浏览型号IRF9Z34LPBF的Datasheet PDF文件第4页浏览型号IRF9Z34LPBF的Datasheet PDF文件第5页浏览型号IRF9Z34LPBF的Datasheet PDF文件第6页浏览型号IRF9Z34LPBF的Datasheet PDF文件第7页 
IRF9Z34S, SiHF9Z34S, IRF9Z34L, SiHF9Z34L  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Advanced Process Technology  
PRODUCT SUMMARY  
VDS (V)  
- 60  
Available  
• Surface Mount (IRF9Z34S/SiHF9Z34S)  
RDS(on) (Ω)  
VGS = - 10 V  
0.14  
Low-Profile Through-Hole (IRSiHF9Z34L/SiHF9Z34L) RoHS*  
COMPLIANT  
Qg (Max.) (nC)  
34  
9.9  
• 175 °C Operating Temperature  
• Fast Switching  
Q
Q
gs (nC)  
gd (nC)  
16  
• P-Channel  
Configuration  
Single  
• Fully Avalanche Rated  
• Lead (Pb)-free Available  
S
DESCRIPTION  
D2PAK (TO-263)  
I2PAK (TO-262)  
Third generation Power MOSFETs from Vishay utilize  
advanced processing techniques to achieve extremely low  
on-resistance per silicon area. This benefit, combined with  
the fast switching speed and ruggedized device design that  
Power MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use in a  
wide variety of applications.  
The D2PAK is a surface mount power package capable of  
accommodating die sizes up to HEX-4. It provides the  
highest power capability and the lowest possible  
on-resistance in any existing surface mount package. The  
D2PAK is suitable for high current applications because of its  
low internal connection resistance and can dissipate up to  
2.0 W in a typical surface mount application.  
G
G
D
S
D
P-Channel MOSFET  
The through-hole version (IRSiHF9Z34L/SiHF9Z34L) is  
available for low-profile applications.  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
D2PAK (TO-263)  
D2PAK (TO-263)  
I2PAK (TO-262)  
IRF9Z34SPbF  
SiHF9Z34S-E3  
IRF9Z34S  
IRF9Z34STRLPbFa  
SiHF9Z34STL-E3a  
IRF9Z34STRLa  
IRF9Z34STRRPbFa  
SiHF9Z34STR-E3a  
IRF9Z34STRRa  
IRF9Z34LPbF  
SiHF9Z34L-E3  
IRF9Z34L  
Lead (Pb)-free  
SnPb  
SiHF9Z34S  
SiHF9Z34STLa  
SiHF9Z34STRa  
SiHF9Z34L  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
- 60  
20  
V
VGS  
TC = 25 °C  
TC =100°C  
- 18  
- 13  
- 72  
0.59  
370  
- 18  
8.8  
Continuous Drain Current  
VGS at - 10 V  
ID  
A
Pulsed Drain Currenta, e  
Linear Derating Factor  
Single Pulse Avalanche Energyb, e  
Avalanche Currenta  
IDM  
W/°C  
mJ  
A
EAS  
IAR  
Repetiitive Avalanche Energya  
EAR  
mJ  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91093  
S-Pending-Rev. A, 03-Jun-08  
www.vishay.com  
1
WORK-IN-PROGRESS  

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