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IRF9Z34N PDF预览

IRF9Z34N

更新时间: 2024-05-23 22:23:25
品牌 Logo 应用领域
友台半导体 - UMW /
页数 文件大小 规格书
8页 687K
描述
种类:P-Channel;漏源电压(Vdss):-55V;持续漏极电流(Id)(在25°C时):-19A;Vgs(th)(V):±20;漏源导通电阻:100mΩ@-10V

IRF9Z34N 数据手册

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R
IRF9Z34  
-55V P-Channel MOSFET  
UUMWW  
Description  
D
The TO-220 package is universally preferred for all  
commercial-industrialapplications at power  
dissipation levels to approximately 50 watts.The  
lowthermal resistance and low package cost of the  
TO-220 contribute to its wide acceptance throughout  
the industry.  
G
S
Features  
l
l
l
l
Advanced Process Technology  
Dynamic dv/dt Rating  
175°C Operating Temperature  
Fast Switching  
l
l
Fully Avalanche Rated  
Lead-Free  
VDS (V) = -55V  
ID = -19A  
l
l
l
RDS(ON)  
< 100m(VGS = -10V)  
Absolute Maximum Ratings  
Parameter  
Maxꢀ  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current   
-19  
-14  
A
-68  
PD @TC = 25°C  
Power Dissipation  
68W  
Linear Derating Factor  
0(45  
W/°C  
V
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
± 20  
Single Pulse Avalanche Energy‚  
Avalanche Current  
180  
mJ  
A
-10  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
6(8mJ  
-5(0  
V/ns  
°C  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw  
300 ꢀ1(6mm from case )  
10 lbf•in ꢀ1(1N•m)  
Thermal Resistance  
Parameter  
Typꢀ  
Maxꢀ  
Units  
RθJC  
RθCS  
RθJA  
Junction-to-Case  
2(2  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
0(50  
°C/W  
62  
www.umw-ic.com  
UTD Semiconductor Co.,Limited  
1
 

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