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IRF9Z34S, SiHF9Z34S PDF预览

IRF9Z34S, SiHF9Z34S

更新时间: 2024-11-26 14:55:11
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威世 - VISHAY /
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描述
Power MOSFET

IRF9Z34S, SiHF9Z34S 数据手册

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IRF9Z34S, SiHF9Z34S  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
S
• Advanced process technology  
D2PAK (TO-263)  
• Surface mount (IRF9Z34S, SiHF9Z34S)  
• 175 °C operating temperature  
• Fast switching  
Available  
Available  
G
• P-channel  
• Fully avalanche rated  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
D
G
S
D
Note  
P-Channel MOSFET  
*
This datasheet provides information about parts that are  
RoHS-compliant and / or parts that are non RoHS-compliant. For  
example, parts with lead (Pb) terminations are not RoHS-compliant.  
Please see the information / tables in this datasheet for details  
PRODUCT SUMMARY  
VDS (V)  
-60  
DESCRIPTION  
Third generation power MOSFETs from Vishay utilize  
advanced processing techniques to achieve extremely low  
on-resistance per silicon area. This benefit, combined with  
the fast switching speed and ruggedized device design that  
power MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use in a  
wide variety of applications.  
R
DS(on) ()  
VGS = -10 V  
0.14  
Qg max. (nC)  
34  
9.9  
16  
Q
gs (nC)  
gd (nC)  
Q
Configuration  
Single  
The D2PAK is a surface mount power package capable of  
accommodating die sizes up to HEX-4. It provides the  
highest power capability and the lowest possible  
on-resistance in any existing surface mount package. The  
D2PAK is suitable for high current applications because of  
its low internal connection resistance and can dissipate up  
to 2.0 W in a typical surface mount application.  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
D2PAK (TO-263)  
D2PAK (TO-263)  
Lead (Pb)-free and Halogen-free  
Lead (Pb)-free  
-
SiHF9Z34STRL-GE3 a  
IRF9Z34STRLPbF a  
SiHF9Z34STRR-GE3 a  
IRF9Z34STRRPbF a  
IRF9Z34SPbF  
Note  
a. See device orientation  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
-60  
20  
V
VGS  
T
C = 25 °C  
-18  
Continuous Drain Current  
VGS at -10 V  
ID  
TC = 100 °C  
-13  
A
Pulsed Drain Current a, e  
Linear Derating Factor  
Single Pulse Avalanche Energy b, e  
Avalanche Current a  
IDM  
-72  
0.59  
370  
W/°C  
mJ  
A
EAS  
IAR  
-18  
Repetitive Avalanche Energy a  
EAR  
8.8  
mJ  
T
C = 25 °C  
88  
Maximum Power Dissipation  
PD  
W
V/ns  
°C  
TA = 25 °C  
3.7  
Peak Diode Recovery dV/dt c, e  
dV/dt  
-4.5  
-55 to +175  
300  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak temperature) d  
TJ, Tstg  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)  
b. VDD = - 25 V, starting TJ = 25 °C, L = 1.3 mH, Rg = 25 , IAS = - 18 A (see fig. 12)  
c. ISD - 18 A, dI/dt 170 A/μs, VDD VDS, TJ 175 °C  
d. 1.6 mm from case  
e. Uses IRF9Z34, SiHF9Z34 data and test conditions  
S21-0943-Rev. F, 20-Sep-2021  
Document Number: 91093  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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