IRF9Z34S, SiHF9Z34S
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
S
• Advanced process technology
D2PAK (TO-263)
• Surface mount (IRF9Z34S, SiHF9Z34S)
• 175 °C operating temperature
• Fast switching
Available
Available
G
• P-channel
• Fully avalanche rated
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
D
G
S
D
Note
P-Channel MOSFET
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
PRODUCT SUMMARY
VDS (V)
-60
DESCRIPTION
Third generation power MOSFETs from Vishay utilize
advanced processing techniques to achieve extremely low
on-resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
power MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use in a
wide variety of applications.
R
DS(on) ()
VGS = -10 V
0.14
Qg max. (nC)
34
9.9
16
Q
gs (nC)
gd (nC)
Q
Configuration
Single
The D2PAK is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible
on-resistance in any existing surface mount package. The
D2PAK is suitable for high current applications because of
its low internal connection resistance and can dissipate up
to 2.0 W in a typical surface mount application.
ORDERING INFORMATION
Package
D2PAK (TO-263)
D2PAK (TO-263)
D2PAK (TO-263)
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
-
SiHF9Z34STRL-GE3 a
IRF9Z34STRLPbF a
SiHF9Z34STRR-GE3 a
IRF9Z34STRRPbF a
IRF9Z34SPbF
Note
a. See device orientation
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
-60
20
V
VGS
T
C = 25 °C
-18
Continuous Drain Current
VGS at -10 V
ID
TC = 100 °C
-13
A
Pulsed Drain Current a, e
Linear Derating Factor
Single Pulse Avalanche Energy b, e
Avalanche Current a
IDM
-72
0.59
370
W/°C
mJ
A
EAS
IAR
-18
Repetitive Avalanche Energy a
EAR
8.8
mJ
T
C = 25 °C
88
Maximum Power Dissipation
PD
W
V/ns
°C
TA = 25 °C
3.7
Peak Diode Recovery dV/dt c, e
dV/dt
-4.5
-55 to +175
300
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) d
TJ, Tstg
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = - 25 V, starting TJ = 25 °C, L = 1.3 mH, Rg = 25 , IAS = - 18 A (see fig. 12)
c. ISD - 18 A, dI/dt 170 A/μs, VDD VDS, TJ 175 °C
d. 1.6 mm from case
e. Uses IRF9Z34, SiHF9Z34 data and test conditions
S21-0943-Rev. F, 20-Sep-2021
Document Number: 91093
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000