IRF9640, SiHF9640
Vishay Siliconix
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
PRODUCT SUMMARY
VDS (V)
- 200
Available
• Repetitive Avalanche Rated
• P-Channel
RDS(on) (Ω)
Qg (Max.) (nC)
Qgs (nC)
VGS = - 10 V
0.50
RoHS*
COMPLIANT
44
7.1
• Fast Switching
• Ease of Paralleling
• Simple Drive Requirements
• Lead (Pb)-free Available
Qgd (nC)
27
Configuration
Single
S
DESCRIPTION
TO-220
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
G
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 W. The low thermal resistance
and low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
S
D
G
D
P-Channel MOSFET
ORDERING INFORMATION
Package
TO-220
IRF9640PbF
SiHF9640-E3
IRF9640
Lead (Pb)-free
SnPb
SiHF9640
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
- 200
20
UNIT
V
VDS
Drain-Source Voltage
Gate-Source Voltage
VGS
V
T
C = 25 °C
- 11
Continuous Drain Current
VGS at - 10 V
ID
TC = 100 °C
- 6.8
- 44
A
Pulsed Drain Currenta
IDM
Linear Derating Factor
1.0
W/°C
mJ
A
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
EAS
IAR
700
- 11
EAR
13
mJ
W
Maximum Power Dissipation
TC = 25 °C
PD
125
Peak Diode Recovery dV/dtc
dV/dt
TJ, Tstg
- 5.0
- 55 to + 150
300d
10
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
°C
for 10 s
lbf · in
N · m
Mounting Torque
6-32 or M3 screw
1.1
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = - 50 V, starting TJ = 25 °C, L = 8.7 mH, RG = 25 Ω, IAS = - 11 A (see fig. 12).
c. ISD ≤ - 11 A, dI/dt ≤ 150 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91086
S-81272-Rev. A, 16-Jun-08
www.vishay.com
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