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IRF9956 PDF预览

IRF9956

更新时间: 2024-11-17 22:51:35
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
7页 110K
描述
Power MOSFET(Vdss=30V, Rds(on)=0.10ohm)

IRF9956 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PDSO-G8Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.13
其他特性:AVALANCHE RATED, HIGH RELIABILITY雪崩能效等级(Eas):44 mJ
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (ID):3.5 A最大漏源导通电阻:0.1 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:MS-012AA
JESD-30 代码:R-PDSO-G8JESD-609代码:e0
湿度敏感等级:1元件数量:2
端子数量:8工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):245极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):16 A认证状态:Not Qualified
表面贴装:YES端子面层:TIN LEAD
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRF9956 数据手册

 浏览型号IRF9956的Datasheet PDF文件第2页浏览型号IRF9956的Datasheet PDF文件第3页浏览型号IRF9956的Datasheet PDF文件第4页浏览型号IRF9956的Datasheet PDF文件第5页浏览型号IRF9956的Datasheet PDF文件第6页浏览型号IRF9956的Datasheet PDF文件第7页 
PD - 9.1559A  
IRF9956  
PRELIMINARY  
HEXFET® Power MOSFET  
l Generation V Technology  
l Ultra Low On-Resistance  
l Dual N-Channel MOSFET  
l Surface Mount  
l Very Low Gate Charge and  
Switching Losses  
1
8
S1  
G1  
D1  
VDSS = 30V  
2
3
7
D1  
6
S2  
G2  
D2  
4
5
D2  
R
DS(on) = 0.10Ω  
l Fully Avalanche Rated  
T o p V iew  
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This  
benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power  
MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use  
in a wide variety of applications.  
Recommended upgrade: IRF7303 or IRF7313  
Lower profile/smaller equivalent: IRF7503  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characteristics and  
multiple-die capability making it ideal in a variety of  
powerapplications. Withtheseimprovements,multiple  
devices can be used in an application with dramatically  
reduced board space. The package is designed for  
vapor phase, infra red, or wave soldering techniques.  
SO-8  
Absolute Maximum Ratings ( TA = 25°C Unless Otherwise Noted)  
Symbol  
Maximum  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
30  
± 20  
3.5  
V
VGS  
TA = 25°C  
TA = 70°C  
Continuous Drain Current  
ID  
2.8  
A
Pulsed Drain Current  
IDM  
IS  
16  
Continuous Source Current (Diode Conduction)  
1.7  
TA = 25°C  
TA = 70°C  
2.0  
Maximum Power Dissipation ꢀ  
PD  
W
1.3  
Single Pulse Avalanche Energy ‚  
Avalanche Current  
EAS  
IAR  
44  
mJ  
A
2.0  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Junction and Storage Temperature Range  
EAR  
0.20  
5.0  
mJ  
V/ ns  
°C  
dv/dt  
TJ, TSTG  
-55 to + 150  
Thermal Resistance Ratings  
Parameter  
Symbol  
Limit  
Units  
Maximum Junction-to-Ambientꢀ  
RθJA  
62.5  
°C/W  
8/25/97  

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IRF9956TR INFINEON

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