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IRF9956TR PDF预览

IRF9956TR

更新时间: 2024-11-18 17:15:43
品牌 Logo 应用领域
友台半导体 - UMW /
页数 文件大小 规格书
7页 473K
描述
种类:N+N-Channel;漏源电压(Vdss):30V;持续漏极电流(Id)(在25°C时):2.2A;Vgs(th)(V):±20;漏源导通电阻:100mΩ@10V

IRF9956TR 数据手册

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R
UMW  
IRF9956  
30V 2N-Channel MOSFET  
Description  
The SOP-8 has been modified through a  
1
2
8
7
customizedeadframe for enhanced thermal  
characteristics anamultiple-die capability making it  
ideal in a variety ofpowerapplications. With these  
improvements, multipledevices can be used in an  
application with dramaticallyreduced board space.  
The package is designed forvapor phase, infra red,  
or wave soldering techniques.  
S1  
D1  
G
1
D1  
D2  
D2  
3
4
6
5
S2  
G
2
Top View  
Features  
VDS (V) =30V  
ID= 2.2A  
(V = -10V)  
GS  
RDS(ON) 100m  
Ω(V  
GS  
=-10V)  
RDS(ON) 200 m  
Ω(V  
GS  
=-4.5V)  
Generation V Technology  
Ultra Low On-Resistance  
Surface Mount  
Very Low Gate Charge and  
Switching Losses  
Fully Avalanche Rated  
Lead-Free  
Absolute Maximum Ratings ( TA = 25°C Unless Otherwise Noted)  
Symbol  
VDS  
VGS  
Maximum  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
30  
± 20  
3.5  
2.8  
16  
V
TA = 25°C  
TA = 70°C  
Continuous Drain Current  
ID  
A
Pulsed Drain Current  
Continuous Source Current (Diode Conduction)  
IDM  
IS  
1.7  
TA = 25°C  
TA = 70°C  
2.0  
1.3  
Maximum Power Dissipation ꢀ  
P
D
W
Single Pulse Avalanche Energy ‚  
Av alan c he Curren t  
EAS  
IAR  
44  
mJ  
A
2.0  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Junction and Storage Temperature Range  
EAR  
0.20  
5.0  
mJ  
dv/dt  
TJ, TSTG  
V/ ns  
°C  
-55 to + 150  
Thermal Resistance Ratings  
Parameter  
Symbol  
Limit  
Units  
Maximum Junction-to-Ambientꢀ  
RθJA  
62.5  
°C/W  
www.umw-ic.com  
1
UTD Semiconductor Co.,Limited  

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