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IRF9952TRPBF PDF预览

IRF9952TRPBF

更新时间: 2024-11-25 12:32:23
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲光电二极管PC
页数 文件大小 规格书
10页 229K
描述
Generation V Technology

IRF9952TRPBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G8Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
Factory Lead Time:15 weeks风险等级:0.7
Samacsys Confidence:3Samacsys Status:Released
Samacsys PartID:785106Samacsys Pin Count:8
Samacsys Part Category:Undefined or MiscellaneousSamacsys Package Category:Small Outline Packages
Samacsys Footprint Name:8 Lead SOICSamacsys Released Date:2019-03-08 16:13:27
Is Samacsys:N其他特性:HIGH RELIABILITY
雪崩能效等级(Eas):44 mJ配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (ID):3.5 A
最大漏源导通电阻:0.1 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:MS-012AAJESD-30 代码:R-PDSO-G8
湿度敏感等级:1元件数量:2
端子数量:8工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL AND P-CHANNEL
最大脉冲漏极电流 (IDM):16 A表面贴装:YES
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRF9952TRPBF 数据手册

 浏览型号IRF9952TRPBF的Datasheet PDF文件第2页浏览型号IRF9952TRPBF的Datasheet PDF文件第3页浏览型号IRF9952TRPBF的Datasheet PDF文件第4页浏览型号IRF9952TRPBF的Datasheet PDF文件第5页浏览型号IRF9952TRPBF的Datasheet PDF文件第6页浏览型号IRF9952TRPBF的Datasheet PDF文件第7页 
PD - 95135  
IRF9952PbF  
HEXFET® Power MOSFET  
l Generation V Technology  
l Ultra Low On-Resistance  
l Dual N and P Channel MOSFET  
l Surface Mount  
l Very Low Gate Charge and  
Switching Losses  
N-CHANNEL MOSFET  
1
8
N-Ch P-Ch  
D1  
D1  
S1  
G1  
2
7
VDSS 30V -30V  
3
4
6
5
S2  
G2  
D2  
D2  
P-CHANNEL MOSFET  
RDS(on) 0.100.25Ω  
l Fully Avalanche Rated  
l Lead-Free  
Top View  
Recommended upgrade: IRF7309 or IRF7319  
Lower profile/smaller equivalent: IRF7509  
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This  
benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power  
MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use  
in a wide variety of applications.  
SO-8  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characteristics and  
multiple-die capability making it ideal in a variety of  
powerapplications. Withtheseimprovements,multiple  
devicescanbeusedinanapplicationwithdramatically  
reduced board space. The package is designed for  
vapor phase, infra red, or wave soldering techniques.  
Symbol  
Maximum  
P-Channel  
Units  
N-Channel  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
30  
± 20  
V
TA = 25°C  
TA = 70°C  
3.5  
2.8  
1
-2.3  
-1.8  
6
Continuous Drain Current  
ID  
A
Pulsed Drain Current  
IDM  
IS  
-1  
0
Continuous Source Current (Diode Conduction)  
1.7  
-1.3  
TA = 25°C  
Maximum Power Dissipation ꢀ  
TA = 70°C  
2.0  
1.3  
P
D
W
Single Pulse Avalanche Energy  
Avalanche Current  
EAS  
IAR  
44  
57  
mJ  
A
2.0  
-1.3  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ‚  
Junction and Storage Temperature Range  
EAR  
0.25  
mJ  
dv/dt  
TJ,TSTG  
5.0  
-5.0  
V/ ns  
-55 to + 150 °C  
Thermal Resistance Ratings  
Parameter  
Symbol  
Limit  
Units  
Maximum Junction-to-Ambient ꢀ  
RθJA  
62.5  
°C/W  
www.irf.com  
1
09/15/04  

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