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IRF840LCLPBF PDF预览

IRF840LCLPBF

更新时间: 2024-11-30 05:39:27
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威世 - VISHAY 晶体晶体管开关脉冲局域网
页数 文件大小 规格书
8页 1029K
描述
Power MOSFET

IRF840LCLPBF 数据手册

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IRF840LCS, IRF840LCL, SiHF840LCS, SiHF840LCL  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
• Ultra Low Gate Charge  
500  
• Reduced Gate Drive Requirement  
Available  
RDS(on) (Ω)  
VGS = 10 V  
0.85  
• Enhanced 30 V VGS Rating  
• Reduced Ciss, Coss, Crss  
• Extremely High Frequency Operation  
• Repetitive Avalanche Rated  
• Lead (Pb)-free Available  
RoHS*  
Qg (Max.) (nC)  
39  
10  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
19  
Configuration  
Single  
DESCRIPTION  
D
This new series of low charge Power MOSFETs achieve  
significantly lower gate charge then conventional Power  
MOSFETs. Utilizing the new LCDMOS (low charge device  
Power MOSFETs) technology, the device improvements are  
achieved without added product cost, allowing for reduced  
gate drive requirements and total system savings. In  
addition, reduced switching losses and improved efficiency  
are achievable in a variety of high frequency applications.  
Frequencies of a few MHz at high current are possible using  
the new low charge Power MOSFETs.  
D2PAK  
(TO-263)  
I2PAK  
(TO-262)  
G
G
D
S
S
N-Channel MOSFET  
These device improvements combined with the proven  
ruggedness and reliability that characterize Power  
MOSFETs offer the designer a new power transistor  
standard for switching applications.  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
IRF840LCSPbF  
D2PAK (TO-263)  
-
-
IRF840LCSTRRa  
SiHF840LCSTa  
I2PAK (TO-262)  
IRF840LCLPbF  
SiHF840LCL-E3  
IRF840LCL  
Lead (Pb)-free  
SiHF840LCS-E3  
IRF840LCS  
SiHF840LCS  
SnPb  
SiHF840LCL  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
500  
30  
V
T
C = 25 °C  
8.0  
Continuous Drain Current  
V
GS at 10 V  
ID  
TC =100°C  
5.1  
A
Pulsed Drain Currenta, e  
Linear Derating Factor  
Single Pulse Avalanche Energyb, e  
Avalanche Currenta  
IDM  
28  
1.0  
W/°C  
mJ  
A
EAS  
IAR  
510  
8.0  
Repetiitive Avalanche Energya  
EAR  
13  
mJ  
T
C = 25 °C  
3.1  
Maximum Power Dissipation  
PD  
W
V/ns  
°C  
TA = 25 °C  
125  
Peak Diode Recovery dV/dtc, e  
dV/dt  
3.5  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 150  
300d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. Starting TJ = 25 °C, L = 14 mH, RG = 25 Ω, IAS = 8.0 A (see fig. 12).  
c. ISD 8.0 A, dI/dt 100 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. Uses IRF840LC/SiHF840LC data and test conditions.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91068  
S-Pending-Rev. A, 02-Jun-08  
www.vishay.com  
1
WORK-IN-PROGRESS  

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