IRF840LCS, IRF840LCL, SiHF840LCS, SiHF840LCL
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• Ultra Low Gate Charge
500
• Reduced Gate Drive Requirement
Available
RDS(on) (Ω)
VGS = 10 V
0.85
• Enhanced 30 V VGS Rating
• Reduced Ciss, Coss, Crss
• Extremely High Frequency Operation
• Repetitive Avalanche Rated
• Lead (Pb)-free Available
RoHS*
Qg (Max.) (nC)
39
10
COMPLIANT
Q
Q
gs (nC)
gd (nC)
19
Configuration
Single
DESCRIPTION
D
This new series of low charge Power MOSFETs achieve
significantly lower gate charge then conventional Power
MOSFETs. Utilizing the new LCDMOS (low charge device
Power MOSFETs) technology, the device improvements are
achieved without added product cost, allowing for reduced
gate drive requirements and total system savings. In
addition, reduced switching losses and improved efficiency
are achievable in a variety of high frequency applications.
Frequencies of a few MHz at high current are possible using
the new low charge Power MOSFETs.
D2PAK
(TO-263)
I2PAK
(TO-262)
G
G
D
S
S
N-Channel MOSFET
These device improvements combined with the proven
ruggedness and reliability that characterize Power
MOSFETs offer the designer a new power transistor
standard for switching applications.
ORDERING INFORMATION
Package
D2PAK (TO-263)
IRF840LCSPbF
D2PAK (TO-263)
-
-
IRF840LCSTRRa
SiHF840LCSTa
I2PAK (TO-262)
IRF840LCLPbF
SiHF840LCL-E3
IRF840LCL
Lead (Pb)-free
SiHF840LCS-E3
IRF840LCS
SiHF840LCS
SnPb
SiHF840LCL
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
500
30
V
T
C = 25 °C
8.0
Continuous Drain Current
V
GS at 10 V
ID
TC =100°C
5.1
A
Pulsed Drain Currenta, e
Linear Derating Factor
Single Pulse Avalanche Energyb, e
Avalanche Currenta
IDM
28
1.0
W/°C
mJ
A
EAS
IAR
510
8.0
Repetiitive Avalanche Energya
EAR
13
mJ
T
C = 25 °C
3.1
Maximum Power Dissipation
PD
W
V/ns
°C
TA = 25 °C
125
Peak Diode Recovery dV/dtc, e
dV/dt
3.5
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
TJ, Tstg
- 55 to + 150
300d
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Starting TJ = 25 °C, L = 14 mH, RG = 25 Ω, IAS = 8.0 A (see fig. 12).
c. ISD ≤ 8.0 A, dI/dt ≤ 100 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
e. Uses IRF840LC/SiHF840LC data and test conditions.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91068
S-Pending-Rev. A, 02-Jun-08
www.vishay.com
1
WORK-IN-PROGRESS