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IRF840LCS, IRF840LCL, SiHF840LCS,  SiHF840LCL PDF预览

IRF840LCS, IRF840LCL, SiHF840LCS, SiHF840LCL

更新时间: 2024-12-01 14:48:55
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描述
Power MOSFET

IRF840LCS, IRF840LCL, SiHF840LCS, SiHF840LCL 数据手册

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IRF840LCS, IRF840LCL, SiHF840LCS, SiHF840LCL  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
D
D2PAK (TO-263)  
I2PAK (TO-262)  
• Ultra low gate charge  
• Reduced gate drive requirement  
• Enhanced 30 V VGS rating  
• Reduced Ciss, Coss, Crss  
• Extremely high frequency operation  
• Repetitive avalanche rated  
Available  
G
G
D
S
D
Available  
S
G
• Material categorization: for definitions of  
compliance please see www.vishay.com/doc?99912  
Note  
S
*
This datasheet provides information about parts that are  
RoHS-compliant and / or parts that are non RoHS-compliant. For  
example, parts with lead (Pb) terminations are not RoHS-compliant.  
Please see the information / tables in this datasheet for details  
N-Channel MOSFET  
PRODUCT SUMMARY  
VDS (V)  
DESCRIPTION  
500  
0.85  
39  
This series of low charge power MOSFETs achieve  
significantly lower gate charge then conventional Power  
MOSFETs. Utilizing the new LCDMOS (low charge device  
Power MOSFETs) technology, the device improvements are  
achieved without added product cost, allowing for reduced  
gate drive requirements and total system savings. In  
addition, reduced switching losses and improved efficiency  
are achievable in a variety of high frequency applications.  
Frequencies of a few MHz at high current are possible using  
the new low charge Power MOSFETs.  
RDS(on) (Ω)  
VGS = 10 V  
Qg max. (nC)  
Q
gs (nC)  
gd (nC)  
10  
Q
19  
Configuration  
Single  
These device improvements combined with the proven  
ruggedness and reliability that characterize Power  
MOSFETs offer the designer a new power transistor  
standard for switching applications.  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
SiHF840LCS-GE3  
I2PAK (TO-262)  
SiHF840LCL-GE3  
IRF840LCLPbF  
-
Lead (Pb)-free and Halogen-free  
IRF840LCSPbF  
Lead (Pb)-free  
IRF840LCSTRRPBF  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
500  
30  
V
TC = 25 °C  
C = 100 °C  
8.0  
Continuous Drain Current  
VGS at 10 V  
ID  
T
5.1  
A
Pulsed Drain Current a, e  
Linear Derating Factor  
Single Pulse Avalanche Energy b, e  
Avalanche Current a  
IDM  
28  
1.0  
W/°C  
mJ  
A
EAS  
IAR  
510  
8.0  
Repetitive Avalanche Energy a  
EAR  
13  
mJ  
T
C = 25 °C  
125  
3.1  
Maximum Power Dissipation  
PD  
W
V/ns  
°C  
TA = 25 °C  
Peak Diode Recovery dV/dt c, e  
dV/dt  
3.5  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak temperature) d  
TJ, Tstg  
-55 to +150  
300  
For 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)  
b. Starting TJ = 25 °C, L = 14 mH, Rg = 25 Ω, IAS = 8.0 A (see fig. 12)  
c. ISD 8.0 A, dI/dt 100 A/μs, VDD VDS, TJ 150 °C  
d. 1.6 mm from case  
e. Uses IRF840LC, SiHF840LC data and test conditions  
S21-0901-Rev. D, 30-Aug-2021  
Document Number: 91068  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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