IRF840LCS, IRF840LCL, SiHF840LCS, SiHF840LCL
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
D
D2PAK (TO-263)
I2PAK (TO-262)
• Ultra low gate charge
• Reduced gate drive requirement
• Enhanced 30 V VGS rating
• Reduced Ciss, Coss, Crss
• Extremely high frequency operation
• Repetitive avalanche rated
Available
G
G
D
S
D
Available
S
G
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
Note
S
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
N-Channel MOSFET
PRODUCT SUMMARY
VDS (V)
DESCRIPTION
500
0.85
39
This series of low charge power MOSFETs achieve
significantly lower gate charge then conventional Power
MOSFETs. Utilizing the new LCDMOS (low charge device
Power MOSFETs) technology, the device improvements are
achieved without added product cost, allowing for reduced
gate drive requirements and total system savings. In
addition, reduced switching losses and improved efficiency
are achievable in a variety of high frequency applications.
Frequencies of a few MHz at high current are possible using
the new low charge Power MOSFETs.
RDS(on) (Ω)
VGS = 10 V
Qg max. (nC)
Q
gs (nC)
gd (nC)
10
Q
19
Configuration
Single
These device improvements combined with the proven
ruggedness and reliability that characterize Power
MOSFETs offer the designer a new power transistor
standard for switching applications.
ORDERING INFORMATION
Package
D2PAK (TO-263)
SiHF840LCS-GE3
I2PAK (TO-262)
SiHF840LCL-GE3
IRF840LCLPbF
-
Lead (Pb)-free and Halogen-free
IRF840LCSPbF
Lead (Pb)-free
IRF840LCSTRRPBF
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
500
30
V
TC = 25 °C
C = 100 °C
8.0
Continuous Drain Current
VGS at 10 V
ID
T
5.1
A
Pulsed Drain Current a, e
Linear Derating Factor
Single Pulse Avalanche Energy b, e
Avalanche Current a
IDM
28
1.0
W/°C
mJ
A
EAS
IAR
510
8.0
Repetitive Avalanche Energy a
EAR
13
mJ
T
C = 25 °C
125
3.1
Maximum Power Dissipation
PD
W
V/ns
°C
TA = 25 °C
Peak Diode Recovery dV/dt c, e
dV/dt
3.5
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) d
TJ, Tstg
-55 to +150
300
For 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. Starting TJ = 25 °C, L = 14 mH, Rg = 25 Ω, IAS = 8.0 A (see fig. 12)
c. ISD ≤ 8.0 A, dI/dt ≤ 100 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
d. 1.6 mm from case
e. Uses IRF840LC, SiHF840LC data and test conditions
S21-0901-Rev. D, 30-Aug-2021
Document Number: 91068
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000