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IRF6898MPBF_15

更新时间： 2024-11-19 01:18:11
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英飞凌 - INFINEON /
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9页 249K
描述
Integrated Monolithic Schottky Diode

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IRF6898MPBF_15 数据手册

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IRF6898MPbF  
IRF6898MTRPbF  
HEXFET® Power MOSFET plus Schottky Diode ‚  
Typical values (unless otherwise specified)  
l RoHs Compliant Containing No Lead and Bromide ‚  
l Integrated Monolithic Schottky Diode  
l Low Profile (<0.7 mm)  
lDual Sided Cooling Compatible   
l Low Package Inductance  
VDSS  
VGS  
RDS(on)  
RDS(on)  
25V max ±16V max  
0.8mΩ@ 10V 1.2mΩ@ 4.5V  
Qg tot Qgd  
Qgs2  
Qrr  
Qoss Vgs(th)  
l Optimized for High Frequency Switching  
l Ideal for CPU Core DC-DC Converters  
l Optimized for Sync. FET socket of Sync. Buck Converter  
l Low Conduction and Switching Losses  
l Compatible with existing Surface Mount Techniques   
l 100% Rg tested  
41nC  
15nC 4.7nC 66nC 43nC  
1.6V  
S
G
D
D
S
DirectFET™ ISOMETRIC  
MX  
MP  
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)  
SQ  
SX  
ST  
MQ  
MT  
MX  
Description  
The IRF6898MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve  
the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible  
with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering  
techniques. Application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual  
sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.  
The IRF6898MPbF balances industry leading on-state resistance while minimizing gate charge along with low gate resistance to reduce both  
conduction and switching losses. This part contains an integrated Schottky diode to reduce the Qrr of the body drain diode further reducing  
the losses in a Synchronous Buck circuit. The reduced losses make this product ideal for high frequency/high efficiency DC-DC converters  
that power high current loads such as the latest generation of microprocessors. The IRF6898MPbF has been optimized for parameters that  
are critical in synchronous buck converter’s Sync FET sockets.  
Absolute Maximum Ratings  
Max.  
25  
Parameter  
Units  
V
VDS  
Drain-to-Source Voltage  
±16  
35  
Gate-to-Source Voltage  
V
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
I
@ TA = 25°C  
D
D
D
28  
A
@ TA = 70°C  
@ TC = 25°C  
213  
280  
473  
28  
DM  
EAS  
IAR  
Single Pulse Avalanche Energy  
Avalanche Current  
mJ  
A
3.0  
2.0  
1.0  
0.0  
14  
12  
10  
8
I = 28A  
D
V
V
= 20V  
I
= 35A  
DS  
D
= 13V  
DS  
T
= 125°C  
J
6
4
2
T
= 25°C  
J
0
2
4
6
8
10  
12  
14  
16  
0
20  
40  
60  
80  
100  
120  
Q
Total Gate Charge (nC)  
V
Gate -to -Source Voltage (V)  
G
GS,  
Fig 1. Typical On-Resistance vs. Gate Voltage  
Fig 2. Typical Total Gate Charge vs. Gate-to-Source Voltage  
Notes:  
„TC measured with thermocouple mounted to top (Drain) of part.  
ꢀRepetitive rating; pulse width limited by max. junction temperature.  
† Starting TJ = 25°C, L = 1.21mH, RG = 50Ω, IAS = 28A.  
Click on this section to link to the appropriate technical paper.  
‚ Click on this section to link to the DirectFET Website.  
ƒSurface mounted on 1 in. square Cu board, steady state.  
1
www.irf.com  
© 2013 International Rectifier  
March 21, 2013  
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