PD - 96101
IRF7103QPbF
AUTOMOTIVE MOSFET
Typical Applications
HEXFET® Power MOSFET
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Anti-lock Braking Systems (ABS)
Electronic Fuel Injection
Power Doors, Windows & Seats
VDSS
50V
RDS(on) max (mW)
130@VGS = 10V
ID
3.0A
Benefits
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Advanced Process Technology
200@VGS = 4.5V
1.5A
Dual N-Channel MOSFET
Ultra Low On-Resistance
175°C Operating Temperature
Repetitive Avalanche Allowed up to Tjmax
Automotive [Q101] Qualified
Lead-Free
1
2
3
4
8
S1
G1
D1
Description
7
D1
Specifically designed for Automotive applications, these
HEXFET® Power MOSFET's in a Dual SO-8 package utilize
the lastest processing techniques to achieve extremely low
on-resistance per silicon area. Additional features of these
Automotive qualified HEXFET Power MOSFET's are a 175°C
junction operating temperature, fast switching speed and
improved repetitive avalanche rating. These benefits combine
to make this design an extremely efficient and reliable device
for use in Automotive applications and a wide variety of other
applications.
6
S2
D2
5
G2
D2
SO-8
Top View
The efficient SO-8 package provides enhanced thermal
characteristics and dual MOSFET die capability making it ideal
in a variety of power applications. This dual, surface mount
SO-8candramaticallyreduceboardspaceandisalsoavailable
in Tape & Reel.
Absolute Maximum Ratings
Parameter
Max.
Units
ID @ TC = 25°C
ID @ TC = 70°C
IDM
Continuous Drain Current, VGS @ 4.5V
Continuous Drain Current, VGS @ 4.5V
Pulsed Drain Current
3.0
2.5
A
25
PD @TC = 25°C
Power Dissipation
Linear Derating Factor
2.4
W
mW/°C
V
16
VGS
Gate-to-Source Voltage
± 20
22
EAS
Single Pulse Avalanche Energy
Avalanche Current
mJ
IAR
See Fig.16c, 16d, 19, 20
A
EAR
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt ꢀ
mJ
dv/dt
TJ, TSTG
12
V/ns
°C
Junction and Storage Temperature Range
-55 to + 175
Thermal Resistance
Symbol
RθJL
Parameter
Junction-to-Drain Lead
Typ.
–––
Max.
20
Units
RθJA
Junction-to-Ambient
–––
50
°C/W
www.irf.com
1
07/23/07