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IRF7103QPBF PDF预览

IRF7103QPBF

更新时间: 2024-09-16 02:59:59
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体小信号场效应晶体管开关脉冲光电二极管局域网
页数 文件大小 规格书
10页 264K
描述
AUTOMOTIVE MOSFET HEXFET㈢ Power MOSFET

IRF7103QPBF 数据手册

 浏览型号IRF7103QPBF的Datasheet PDF文件第2页浏览型号IRF7103QPBF的Datasheet PDF文件第3页浏览型号IRF7103QPBF的Datasheet PDF文件第4页浏览型号IRF7103QPBF的Datasheet PDF文件第5页浏览型号IRF7103QPBF的Datasheet PDF文件第6页浏览型号IRF7103QPBF的Datasheet PDF文件第7页 
PD - 96101  
IRF7103QPbF  
AUTOMOTIVE MOSFET  
Typical Applications  
HEXFET® Power MOSFET  
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l
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Anti-lock Braking Systems (ABS)  
Electronic Fuel Injection  
Power Doors, Windows & Seats  
VDSS  
50V  
RDS(on) max (mW)  
130@VGS = 10V  
ID  
3.0A  
Benefits  
l
l
l
l
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Advanced Process Technology  
200@VGS = 4.5V  
1.5A  
Dual N-Channel MOSFET  
Ultra Low On-Resistance  
175°C Operating Temperature  
Repetitive Avalanche Allowed up to Tjmax  
Automotive [Q101] Qualified  
Lead-Free  
1
2
3
4
8
S1  
G1  
D1  
Description  
7
D1  
Specifically designed for Automotive applications, these  
HEXFET® Power MOSFET's in a Dual SO-8 package utilize  
the lastest processing techniques to achieve extremely low  
on-resistance per silicon area. Additional features of these  
Automotive qualified HEXFET Power MOSFET's are a 175°C  
junction operating temperature, fast switching speed and  
improved repetitive avalanche rating. These benefits combine  
to make this design an extremely efficient and reliable device  
for use in Automotive applications and a wide variety of other  
applications.  
6
S2  
D2  
5
G2  
D2  
SO-8  
Top View  
The efficient SO-8 package provides enhanced thermal  
characteristics and dual MOSFET die capability making it ideal  
in a variety of power applications. This dual, surface mount  
SO-8candramaticallyreduceboardspaceandisalsoavailable  
in Tape & Reel.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 70°C  
IDM  
Continuous Drain Current, VGS @ 4.5V  
Continuous Drain Current, VGS @ 4.5V  
Pulsed Drain Current   
3.0  
2.5  
A
25  
PD @TC = 25°C  
Power Dissipationƒ  
Linear Derating Factor  
2.4  
W
mW/°C  
V
16  
VGS  
Gate-to-Source Voltage  
± 20  
22  
EAS  
Single Pulse Avalanche Energy„  
Avalanche Current  
mJ  
IAR  
See Fig.16c, 16d, 19, 20  
A
EAR  
Repetitive Avalanche Energy†  
Peak Diode Recovery dv/dt ꢀ  
mJ  
dv/dt  
TJ, TSTG  
12  
V/ns  
°C  
Junction and Storage Temperature Range  
-55 to + 175  
Thermal Resistance  
Symbol  
RθJL  
Parameter  
Junction-to-Drain Lead  
Typ.  
–––  
Max.  
20  
Units  
RθJA  
Junction-to-Ambient ƒ  
–––  
50  
°C/W  
www.irf.com  
1
07/23/07  

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