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IRF7103QHR PDF预览

IRF7103QHR

更新时间: 2024-11-09 13:08:47
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关光电二极管
页数 文件大小 规格书
9页 171K
描述
Small Signal Field-Effect Transistor, 3A I(D), 50V, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MS-012AA, SOP-8

IRF7103QHR 数据手册

 浏览型号IRF7103QHR的Datasheet PDF文件第2页浏览型号IRF7103QHR的Datasheet PDF文件第3页浏览型号IRF7103QHR的Datasheet PDF文件第4页浏览型号IRF7103QHR的Datasheet PDF文件第5页浏览型号IRF7103QHR的Datasheet PDF文件第6页浏览型号IRF7103QHR的Datasheet PDF文件第7页 
PD - 9.1095B  
IRF7103  
HEXFET® Power MOSFET  
l Adavanced Process Technology  
l Ultra Low On-Resistance  
l Dual N-Channel MOSFET  
l Surface Mount  
l Available in Tape & Reel  
l Dynamic dv/dt Rating  
l Fast Switching  
1
2
8
D1  
S1  
VDSS = 50V  
7
G 1  
D 1  
3
6
S2  
D2  
RDS(on) = 0.130Ω  
4
5
D 2  
G 2  
ID = 3.0A  
Top View  
Description  
Fourth Generation HEXFETs from International  
Rectifier utilize advanced processing techniques to  
achieve the lowest possible on-resistance per silicon  
area. This benefit, combined with the fast switching  
speed and ruggedized device design that HEXFET  
Power MOSFETs are well known for, provides the  
designer with an extremely efficient device for use in  
a wide variety of applications.  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characteristics and  
dual-die capability making it ideal in a variety of power  
applications. With these improvements, multiple  
devicescanbeusedinanapplicationwithdramatically  
reduced board space. The package is designed for  
vapor phase, infra red, or wave soldering techniques.  
Power dissipation of greater than 0.8W is possible in  
a typical PCB mount application.  
SO-8  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
3.0  
2.3  
A
10  
PD @TC = 25°C  
Power Dissipation  
2.0  
W
W/°C  
V
Linear Derating Factor  
0.016  
± 20  
VGS  
Gate-to-Source Voltage  
dv/dt  
Peak Diode Recovery dv/dt ‚  
4.5  
V/nS  
TJ,TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance Ratings  
Parameter  
Min.  
Typ.  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambient „  
–––  
–––  
62.5  
°C/W  
8/25/97  

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