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IRF6718L2TR PDF预览

IRF6718L2TR

更新时间: 2024-11-02 05:39:27
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英飞凌 - INFINEON /
页数 文件大小 规格书
10页 281K
描述
DirectFET Power MOSFET

IRF6718L2TR 数据手册

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PD - 97395B  
IRF6718L2TRPbF  
IRF6718L2TR1PbF  
DirectFET™ Power MOSFET ‚  
l RoHS Compliant Containing No Lead and Bromide   
l Dual Sided Cooling Compatible   
Typical values (unless otherwise specified)  
VDSS  
VGS  
RDS(on)  
RDS(on)  
l Ultra Low Package Inductance  
25V max ±20V max  
0.50m@10V 1.0m@4.5V  
l Very Low RDS(ON) for Reduced Conduction Losses  
l Optimized for Active O-Ring / Efuse Applications  
l Compatible with existing Surface Mount Techniques   
Qg tot Qgd  
Qgs2  
Qrr  
Qoss Vgs(th)  
64nC  
20nC  
9.4nC  
67nC  
50nC  
1.9V  
DirectFET™ ISOMETRIC  
L6  
Applicable DirectFET Outline and Substrate Outline   
S1  
S2  
SB  
M2  
M4  
L4  
L6  
L8  
Description  
The IRF6718L2TRPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to  
achieve the lowest on-state resistance in a package that has the footprint of a D-pak. The DirectFET package is compatible with existing  
layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques,  
when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided  
cooling to maximize thermal transfer in power systems.  
The IRF6718L2TRPbF has extremely low Si Rdson coupled with ultra low package resistance to minimize conduction losses. The  
IRF6718L2TRPbF has been optimized for parameters that are critical in reliable operation on Active O-Ring / Efuse / hot swap applications.  
Absolute Maximum Ratings  
Max.  
25  
Parameter  
Units  
V
VDS  
Drain-to-Source Voltage  
±20  
61  
V
Gate-to-Source Voltage  
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
I
@ TA = 25°C  
D
D
D
52  
@ TA = 70°C  
@ TC = 25°C  
A
270  
490  
530  
49  
DM  
EAS  
IAR  
Single Pulse Avalanche Energy  
Avalanche Current  
mJ  
A
4
3
2
1
0
14.0  
12.0  
10.0  
8.0  
I
= 61A  
I = 49A  
D
D
V
V
= 20V  
DS  
DS  
= 13V  
6.0  
T
= 125°C  
J
4.0  
2.0  
T
= 25°C  
4
J
0.0  
2
6
8
10  
0
20 40 60 80 100 120 140 160 180  
Total Gate Charge (nC)  
Q
G
V
Gate -to -Source Voltage (V)  
GS,  
Fig 1. Typical On-Resistance vs. Gate Voltage  
Fig 2. Typical Total Gate Charge vs Gate-to-Source Voltage  
Notes:  
„ TC measured with thermocouple mounted to top (Drain) of part.  
Repetitive rating; pulse width limited by max. junction temperature.  
† Starting TJ = 25°C, L = 0.44mH, RG = 25, IAS = 49A.  
 Click on this section to link to the appropriate technical paper.  
‚ Click on this section to link to the DirectFET Website.  
ƒ Surface mounted on 1 in. square Cu board, steady state.  
www.irf.com  
1
01/26/2010  

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