PD - 97441
IRF6723M2DTRPbF
IRF6723M2DTR1PbF
Applications
l Dual Common Drain Control MOSFETs for
Multiphase DC-DC Converters
DirectFET Power MOSFET
Typical values (unless otherwise specified)
Features
l Replaces Two Discrete MOSFETs
l Optimized for High Frequency Switching
l Low Profile (<0.7 mm)
l Dual Sided Cooling Compatible
l Ultra Low Package Inductance
l Compatible with existing Surface Mount
Techniques
VDSS
30V max ±20V max
VGS
RDS(on)
RDS(on)
5.2mΩ@ 10V 8.6mΩ@ 4.5V
Qg tot Qgd
Qgs2
Qrr
Qoss Vgs(th)
9.4nC 3.3nC 1.2nC
17nC
6.3nC
1.8V
l RoHS Compliant and Halogen Free
l 100% Rg tested
G1
S1
G2
S2
DirectFET ISOMETRIC
Applicable DirectFET Outline and Substrate Outline
S1
S2
SB
M2
M4
MA
L4
L6
L8
Description
The IRF6723M2DPbF combines two MOSFET switches optimized for high side applications into a single medium can DirectFET package.
The switches have low gate resistance and low charge along with ultra low package inductance providing significant reduction in switching
losses. The reduced losses make this product ideal for high efficiency multiphase DC-DC converters that power the latest generation of
processors operating at higher frequencies.
The IRF6723M2DPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to
achieve the highest power density for two MOSFETs in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET
package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or
convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The
DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by
80%.
Absolute Maximum Ratings (each die operating consecutively)
Max.
30
Parameter
Units
V
VDS
Drain-to-Source Voltage
±20
15
V
Gate-to-Source Voltage
GS
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
I
I
I
I
@ TA = 25°C
D
D
D
13
@ TA = 70°C
@ TC = 25°C
A
47
130
71
DM
EAS
IAR
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
12
25
20
15
10
5
14.0
12.0
10.0
8.0
I
= 15A
I = 12A
D
D
V
= 24V
= 15V
DS
V
DS
T
= 125°C
J
6.0
4.0
2.0
T
= 25°C
J
0
0.0
2
4
6
8
10 12 14 16 18 20
0
5
10
15
20
25
Q
Total Gate Charge (nC)
G
V
Gate -to -Source Voltage (V)
GS,
Fig 1. Typical On-Resistance vs. Gate Voltage
Fig 2. Typical Total Gate Charge vs Gate-to-Source Voltage
Notes:
TC measured with thermocouple mounted to top (Drain) of part.
ꢀ Repetitive rating; pulse width limited by max. junction temperature.
Starting TJ = 25°C, L = 0.99mH, RG = 25Ω, IAS = 12A.
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
www.irf.com
1
12/16/09