PD - 96136
IRF6722MPbF
IRF6722MTRPbF
DirectFET Power MOSFET
Typical values (unless otherwise specified)
l RoHS Compliant Containing No Lead and Bromide
l Low Profile (<0.7 mm)
VDSS
VGS
RDS(on)
RDS(on)
30V max ±20V max
4.7mΩ@ 10V 8.0mΩ@ 4.5V
l Dual Sided Cooling Compatible
l Ultra Low Package Inductance
Qg tot Qgd
Qgs2
Qrr
Qoss Vgs(th)
l Optimized for High Frequency Switching
l Ideal for CPU Core DC-DC Converters
l Optimized for Control FET application
l Low Conduction and Switching Losses
l Compatible with existing Surface Mount Techniques
l 100% Rg tested
11nC
4.3nC 1.2nC
26nC
11nC
1.8V
DirectFET ISOMETRIC
MP
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)
SQ
SX
ST
MQ
MX
MT
MP
Description
The IRF6722MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve
the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is
compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection
soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET pack-
age allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF6722MPbF balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and
switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of
processors operating at higher frequencies. The IRF6722MPbF has been optimized for parameters that are critical in synchronous buck
operating from 12 volt bus converters including Rds(on) and gate charge to minimize losses.
Absolute Maximum Ratings
Max.
30
Parameter
Units
V
VDS
Drain-to-Source Voltage
±20
13
V
Gate-to-Source Voltage
GS
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
I
I
I
I
@ TA = 25°C
D
D
D
11
@ TA = 70°C
@ TC = 25°C
A
56
110
82
DM
EAS
IAS
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
11
20
15
10
5
14.0
12.0
10.0
8.0
I
= 13A
I = 11A
D
D
V
V
= 24V
DS
DS
= 15V
6.0
T
= 125°C
J
4.0
2.0
T
= 25°C
J
0
0.0
0
2
4
6
8
10 12 14 16 18 20
0
4
8
12
16
20
24
28
Q , Total Gate Charge (nC)
G
V
Gate -to -Source Voltage (V)
GS,
Fig 1. Typical On-Resistance vs. Gate Voltage
Fig 2. Typical Total Gate Charge vs. Gate-to-Source Voltage
Notes:
TC measured with thermocouple mounted to top (Drain) of part.
ꢀ Repetitive rating; pulse width limited by max. junction temperature.
Starting TJ = 25°C, L = 1.45mH, RG = 25Ω, IAS = 11A.
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
www.irf.com
1
11/12/07