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HY5RS573225AFP-11 PDF预览

HY5RS573225AFP-11

更新时间: 2024-11-20 18:32:43
品牌 Logo 应用领域
海力士 - HYNIX 时钟动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
64页 1093K
描述
DDR DRAM, 8MX32, 0.25ns, CMOS, PBGA136, 11 X 14 MM, ROHS COMPLIANT, FBGA-136

HY5RS573225AFP-11 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:TFBGA, BGA136,12X17,32
针数:136Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.24
风险等级:5.84访问模式:FOUR BANK PAGE BURST
最长访问时间:0.25 ns其他特性:AUTO/SELF REFRESH
最大时钟频率 (fCLK):909 MHzI/O 类型:COMMON
交错的突发长度:4,8JESD-30 代码:R-PBGA-B136
JESD-609代码:e1长度:14 mm
内存密度:268435456 bit内存集成电路类型:DDR DRAM
内存宽度:32功能数量:1
端口数量:1端子数量:136
字数:8388608 words字数代码:8000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:组织:8MX32
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装等效代码:BGA136,12X17,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:1.8 V
认证状态:Not Qualified刷新周期:4096
座面最大高度:1.2 mm自我刷新:YES
连续突发长度:4,8子类别:DRAMs
最大供电电压 (Vsup):2.3 V最小供电电压 (Vsup):2.1 V
标称供电电压 (Vsup):2.2 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:20宽度:11 mm
Base Number Matches:1

HY5RS573225AFP-11 数据手册

 浏览型号HY5RS573225AFP-11的Datasheet PDF文件第2页浏览型号HY5RS573225AFP-11的Datasheet PDF文件第3页浏览型号HY5RS573225AFP-11的Datasheet PDF文件第4页浏览型号HY5RS573225AFP-11的Datasheet PDF文件第5页浏览型号HY5RS573225AFP-11的Datasheet PDF文件第6页浏览型号HY5RS573225AFP-11的Datasheet PDF文件第7页 
HY5RS573225AFP  
256M (8Mx32) GDDR3 SDRAM  
HY5RS573225AFP  
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any  
responsibility for use of circuits described. No patent licenses are implied.  
Rev. 1.7 / Aug. 2006  
1

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Synchronous DRAM, 8MX16, 9ns, CMOS, PBGA54, 8.30 X 10.50 MM, 0.80 MM PITCH, FBGA-54
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Synchronous DRAM, 8MX16, 7ns, CMOS, PBGA54, 8.30 X 10.50 MM, 0.80 MM PITCH, FBGA-54
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Synchronous DRAM, 8MX16, 9ns, CMOS, PBGA54, 8.30 X 10.50 MM, 0.80 MM PITCH, FBGA-54
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