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HY5S56DF-SF PDF预览

HY5S56DF-SF

更新时间: 2024-11-24 20:57:15
品牌 Logo 应用领域
海力士 - HYNIX 时钟动态存储器内存集成电路
页数 文件大小 规格书
23页 399K
描述
Synchronous DRAM, 16MX16, 7ns, CMOS, PBGA54

HY5S56DF-SF 技术参数

生命周期:Obsolete包装说明:FBGA, BGA54,9X9,32
Reach Compliance Code:compliant风险等级:5.84
最长访问时间:7 ns最大时钟频率 (fCLK):105 MHz
I/O 类型:COMMON交错的突发长度:1,2,4,8
JESD-30 代码:S-PBGA-B54内存密度:268435456 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:16
端子数量:54字数:16777216 words
字数代码:16000000最高工作温度:70 °C
最低工作温度:-25 °C组织:16MX16
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装等效代码:BGA54,9X9,32
封装形状:SQUARE封装形式:GRID ARRAY, FINE PITCH
电源:1.8 V认证状态:Not Qualified
刷新周期:8192连续突发长度:1,2,4,8,FP
最大待机电流:0.0005 A子类别:DRAMs
最大压摆率:0.14 mA标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
Base Number Matches:1

HY5S56DF-SF 数据手册

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Preliminary  
HY5S5A6DF-xF  
4Banks x 4M x 16bits Synchronous DRAM  
DESCRIPTION  
The Hynix Low Power SDRAM is suited for non-PC application which use the batteries such as PDAs,  
2.5G and 3G cellular phones with internet access and multimedia capabilities, mini-notebook, handheld  
PCs.  
The Hynix HY5S5A6DF is a 268,435,456bit CMOS Synchronous Dynamic Random Access Memory. It is  
organized as 4banks of 4,194,304x16.  
The Low Power SDRAM provides for programmable options including CAS latency of 1, 2, or 3, READ or  
WRITE burst length of 1, 2, 4, 8, or full page, and the burst count sequence(sequential or interleave).  
And the Low Power SDRAM also provides for special programmable options including Partial Array Self  
Refresh of a quarter bank, a half bank, 1bank, 2banks, or all banks, Temperature Compensated Self  
Refresh of 15, 45, 70, or 85 degrees C. A burst of Read or Write cycles in progress can be terminated  
by a burst terminate command or can be interrupted and replaced by a new burst Read or Write com-  
mand on any cycle(This pipelined design is not restricted by a 2N rule).  
Deep Power Down Mode is a additional operating mode for Low Power SDRAM. This mode can achieve  
maximum power reduction by removing power to the memory array within each SDRAM. By using this  
feature, the system can cut off alomost all DRAM power without adding the cost of a power switch and  
giving up mother-board power-line layout flexibility.  
FEATURES  
• Standard SDRAM Protocol  
• Internal 4bank operation  
• Voltage : VDD = 1.8V, VDDQ = 1.8V  
• LVCMOS compatible I/O Interface  
• Low Voltage interface to reduce I/O power  
• Low Power Features ( HY5S56DF Series can’t support these features)  
- PASR(Partial Array Self Refresh)  
- TCSR(Temperature Compensated Self Refresh)  
- DS(Drive Strength)  
- Deep Power Down Mode  
• CAS latency of 1, 2, or 3  
• Packages : 54ball, 0.8mm pitch FBGA  
• -25 ~ 70C Operation  
ORDERING INFORMATION  
Clock  
Frequency Latency  
CAS  
Part Number  
Organization  
Interface  
Package  
HY5S5A6D(L/S)F-SF  
HY5S56DF-SF  
105MHz  
66Mhz  
3
2
4banks x 4Mb x 16  
LVCMOS  
54ball  
FBGA  
HHY5S5A6D(L/S)F-BF  
HY5S56DF-BF  
4banks x 4Mb x 16  
LVCMOS  
* HY5xxxxx-B Series can support 40Mhz CL1 and 33Mhz CL1.  
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for  
use of circuits described. No patent licenses are implied.  
Rev. 0.2 / June. 2003  

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