HGTP12N60C3, HGT1S12N60C3, HGT1S12N60C3S
Test Circuit and Waveform
90%
OFF
L = 100µH
10%
V
RHRP1560
GE
E
E
ON
V
CE
R
= 25Ω
G
90%
+
-
10%
D(OFF)I
V
= 480V
DD
I
CE
t
t
RI
t
FI
t
D(ON)I
FIGURE 18. INDUCTIVE SWITCHING TEST CIRCUIT
FIGURE 19. SWITCHING TEST WAVEFORMS
Handling Precautions for IGBTs
Operating Frequency Information
Insulated Gate Bipolar Transistors are susceptible to gate- Operating frequency information for
a typical device
insulation damage by the electrostatic discharge of energy Figure 13) is presented as a guide for estimating device per-
through the devices. When handling these devices, care formance for a specific application. Other typical frequency
should be exercised to assure that the static charge built in vs collector current (I ) plots are possible using the infor-
CE
the handler’s body capacitance is not discharged through mation shown for a typical unit in Figures 4, 7, 8, 11 and 12.
the device. With proper handling and application procedures, The operating frequency plot (Figure 13) of a typical device
however, IGBTs are currently being extensively used in pro- shows f
or f
whichever is smaller at each point.
MAX1
MAX2
duction by numerous equipment manufacturers in military, The information is based on measurements of
a
industrial and consumer applications, with virtually no dam- typical device and is bounded by the maximum rated junc-
age problems due to electrostatic discharge. IGBTs can be tion temperature.
handled safely if the following basic precautions are taken:
f
is defined by f
= 0.05/(t
MAX1
+ t ). Dead-
D(OFF)I D(ON)I
MAX1
1. Prior to assembly into a circuit, all leads should be kept
time (the denominator) has been arbitrarily held to 10% of
shorted together either by the use of metal shorting the on- state time for a 50% duty factor. Other definitions are
springs or by the insertion into conductive material such possible. t and t are defined in Figure 19.
D(OFF)I
Device turn-off delay can establish an additional frequency
limiting condition for an application other than T
D(ON)I
as “ECCOSORBD LD26” or equivalent.
.
JMAX
is important when controlling output ripple under a
2. When devices are removed by hand from their carriers,
the hand being used should be grounded by any suitable
means - for example, with a metallic wristband.
t
D(OFF)I
lightly loaded condition.
f
is defined by f
MAX2
= (P - P )/(E
OFF
+ E ). The
ON
MAX2
D
C
3. Tips of soldering irons should be grounded.
allowable dissipation (P ) is defined by P = (T
-
D
D
JMAX
T )/R . The sum of device switching and conduction losses
4. Devices should never be inserted into or removed from
circuits with power on.
C
θJC
must not exceed P . A 50% duty factor was used (Figure 13)
D
and the conduction losses (P ) are approximated by P = (V
x I )/2.
CE
C
C
CE
5. Gate Voltage Rating - Never exceed the gate-voltage rat-
ing of V
. Exceeding the rated V can result in per-
GEM
GE
E
and E
OFF
are defined in the switching waveforms
is the integral of the instantaneous
is the inte-
manent damage to the oxide layer in the gate region.
ON
shown in Figure 19. E
power loss (I
ON
CE
6. Gate Termination - The gates of these devices are es-
sentially capacitors. Circuits that leave the gate open-cir-
cuited or floating should be avoided. These conditions
can result in turn-on of the device due to voltage buildup
on the input capacitor due to leakage currents or pickup.
x V ) during turn-on and E
CE
OFF
gral of the instantaneous power loss (I x V ) during turn-
CE CE
off. All tail losses are included in the calculation for E
OFF
; i.e.
the collector current equals zero (I
= 0).
CE
7. Gate Protection - These devices do not have an internal
monolithic zener diode from gate to emitter. If gate pro-
tection is required an external zener is recommended.
ECCOSORBD is a Trademark of Emerson and Cumming, Inc.
3-34