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GS88036BT-250 PDF预览

GS88036BT-250

更新时间： 2024-09-20 04:56:27
品牌 Logo 应用领域
GSI 存储静态存储器
页数 文件大小 规格书
24页 605K
描述
512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs

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GS88036BT-250 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
零件包装代码：QFP包装说明：LQFP, QFP100,.63X.87
针数：100Reach Compliance Code：unknown
ECCN代码：3A991.B.2.BHTS代码：8542.32.00.41
风险等级：5.85最长访问时间：5.5 ns
其他特性：FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLYI/O 类型：COMMON
JESD-30 代码：R-PQFP-G100长度：20 mm
内存密度：9437184 bit内存集成电路类型：CACHE SRAM
内存宽度：36湿度敏感等级：3
功能数量：1端子数量：100
字数：262144 words字数代码：256000
工作模式：SYNCHRONOUS最高工作温度：70 °C
最低工作温度：组织：256KX36
输出特性：3-STATE封装主体材料：PLASTIC/EPOXY
封装代码：LQFP封装等效代码：QFP100,.63X.87
封装形状：RECTANGULAR封装形式：FLATPACK, LOW PROFILE
并行/串行：PARALLEL峰值回流温度（摄氏度）：NOT SPECIFIED
电源：2.5/3.3 V认证状态：Not Qualified
座面最大高度：1.6 mm最大待机电流：0.04 A
最小待机电流：2.3 V子类别：SRAMs
最大压摆率：0.2 mA最大供电电压 (Vsup)：2.7 V
最小供电电压 (Vsup)：2.3 V标称供电电压 (Vsup)：2.5 V
表面贴装：YES技术：CMOS
温度等级：COMMERCIAL端子形式：GULL WING
端子节距：0.65 mm端子位置：QUAD
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：14 mm

GS88036BT-250 数据手册

 浏览型号GS88036BT-250的Datasheet PDF文件第2页浏览型号GS88036BT-250的Datasheet PDF文件第3页浏览型号GS88036BT-250的Datasheet PDF文件第4页浏览型号GS88036BT-250的Datasheet PDF文件第5页浏览型号GS88036BT-250的Datasheet PDF文件第6页浏览型号GS88036BT-250的Datasheet PDF文件第7页 
GS88018/32/36BT-333/300/250/200/150  
333 MHz–150 MHz  
100-Pin TQFP  
Commercial Temp  
Industrial Temp  
512K x 18, 256K x 32, 256K x 36  
9Mb Sync Burst SRAMs  
2.5 V or 3.3 V V  
DD  
2.5 V or 3.3 V I/O  
interleave order with the Linear Burst Order (LBO) input. The  
Burst function need not be used. New addresses can be loaded  
on every cycle with no degradation of chip performance.  
Features  
• FT pin for user-configurable flow through or pipeline  
operation  
• Single Cycle Deselect (SCD) operation  
• 2.5 V or 3.3 V +10%/–10% core power supply  
• 2.5 V or 3.3 V I/O supply  
Flow Through/Pipeline Reads  
The function of the Data Output register can be controlled by  
the user via the FT mode pin (Pin 14). Holding the FT mode  
pin low places the RAM in Flow Through mode, causing  
output data to bypass the Data Output Register. Holding FT  
high places the RAM in Pipeline mode, activating the rising-  
edge-triggered Data Output Register.  
• LBO pin for Linear or Interleaved Burst mode  
• Internal input resistors on mode pins allow floating mode pins  
• Default to Interleaved Pipeline mode  
• Byte Write (BW) and/or Global Write (GW) operation  
• Internal self-timed write cycle  
SCD Pipelined Reads  
• Automatic power-down for portable applications  
• JEDEC-standard 100-lead TQFP package  
• Pb-Free 100-lead TQFP package available  
The GS88018/32/36BT is a SCD (Single Cycle Deselect)  
pipelined synchronous SRAM. DCD (Dual Cycle Deselect)  
versions are also available. SCD SRAMs pipeline deselect  
commands one stage less than read commands. SCD RAMs  
begin turning off their outputs immediately after the deselect  
command has been captured in the input registers.  
Functional Description  
Applications  
The GS88018/32/36BT is a 9,437,184-bit (8,388,608-bit for  
x32 version) high performance synchronous SRAM with a  
2-bit burst address counter. Although of a type originally  
developed for Level 2 Cache applications supporting high  
performance CPUs, the device now finds application in  
synchronous SRAM applications, ranging from DSP main  
store to networking chip set support.  
Byte Write and Global Write  
Byte write operation is performed by using Byte Write enable  
(BW) input combined with one or more individual byte write  
signals (Bx). In addition, Global Write (GW) is available for  
writing all bytes at one time, regardless of the Byte Write  
control inputs.  
Controls  
Sleep Mode  
Addresses, data I/Os, chip enables (E1, E2, E3), address burst  
control inputs (ADSP, ADSC, ADV), and write control inputs  
(Bx, BW, GW) are synchronous and are controlled by a  
positive-edge-triggered clock input (CK). Output enable (G)  
and power down control (ZZ) are asynchronous inputs. Burst  
cycles can be initiated with either ADSP or ADSC inputs. In  
Burst mode, subsequent burst addresses are generated  
internally and are controlled by ADV. The burst address  
counter may be configured to count in either linear or  
Low power (Sleep mode) is attained through the assertion  
(High) of the ZZ signal, or by stopping the clock (CK).  
Memory data is retained during Sleep mode.  
Core and Interface Voltages  
The GS88018/32/36BT operates on a 2.5 V or 3.3 V power  
supply. All input are 3.3 V and 2.5 V compatible. Separate  
output power (V  
) pins are used to decouple output noise  
DDQ  
from the internal circuits and are 3.3 V and 2.5 V compatible.  
Parameter Synopsis  
-333  
-300  
-250  
-200  
-150  
Unit  
tKQ  
2.5  
3.0  
2.5  
3.3  
2.5  
4.0  
3.0  
5.0  
3.8  
6.7  
ns  
ns  
tCycle  
Pipeline  
3-1-1-1  
Curr (x18)  
Curr (x32/x36)  
250  
290  
230  
265  
200  
230  
170  
195  
140  
160  
mA  
mA  
tKQ  
4.5  
4.5  
5.0  
5.0  
5.5  
5.5  
6.5  
6.5  
7.5  
7.5  
ns  
ns  
tCycle  
Flow Through  
2-1-1-1  
Curr (x18)  
Curr (x32/x36)  
200  
230  
185  
210  
160  
185  
140  
160  
128  
145  
mA  
mA  
Rev: 1.04 2/2005  
1/24  
© 2002, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
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与GS88036BT-250相关器件

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GS88036BT-250I GSI

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 		512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
GS88036BT-250IV GSI

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 		暂无描述
GS88036BT-250IVT GSI

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 		Cache SRAM, 256KX36, 5.5ns, CMOS, PQFP100, TQFP-100
GS88036BT-250V GSI

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 		暂无描述
GS88036BT-300 GSI

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 		512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
GS88036BT-300I GSI

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 		512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
GS88036BT-300IT ROCHESTER

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 		Cache SRAM, 256KX36, 5ns, CMOS, PQFP100, TQFP-100
GS88036BT-333 GSI

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 		512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
GS88036BT-333I GSI

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 		512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
GS88036BT-333IT ROCHESTER

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 		Cache SRAM, 256KX36, 4.5ns, CMOS, PQFP100, TQFP-100

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