Datasheet > FGPF4633RDTU

FGPF4633RDTU

更新时间： 2024-11-03 01:03:03

品牌	Logo	应用领域
飞兆/仙童 - FAIRCHILD		/
页数	文件大小	规格书
14页	298K
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DESIGN/PROCESS CHANGE NOTIFICATION

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FGPF4633RDTU 数据手册

PCN# : P315A

Issue Date : Feb. 04, 2013

DESIGN/PROCESS CHANGE NOTIFICATION

This is to inform you that a change is being made to the products listed below.

Unless otherwise indicated in the details of this notification, the identified change will have no impact on product

quality, reliability, electrical, visual or mechanical performance and affected products will remain fully compliant to all

published specifications. Products incorporating this change may be shipped interchangeably with existing unchanged

products.

This change is planned to take effect in 90 calendar days from the date of this notification. Please work with your local

Fairchild Sales Representative to manage your inventory of unchanged product if your evaluation of this change will

require more than 90 calendar days.

Please contact your local Customer Quality Engineer within 30 days of receipt of this notification if you require any

additional data or samples. Alternatively, you may send an email request for data, samples or other information to

PCNSupport@fairchildsemi.com.

Implementation of change:

Expected First Shipment Date for Changed Product : May. 05, 2013

Expected First Date Code of Changed Product :1327

Description of Change (From) :

5/6-in wafer fabrication line at Fairchild Semiconductor Bucheon Korea.

Description of Change (To) :

8-in wafer fabrication line at Fairchild Semiconductor Bucheon Korea.

Reason for Change:

Fairchild Semiconductor is increasing wafer fabrication capacity by qualifying an 8-in wafer fabrication line at Fairchild

Semiconductor Bucheon Korea. Quality and reliability remain at the highest standards already demonstrated within

Fairchild's existing products. The reliability qualification results used to qualify the 8-in wafer fabrication line are

summarized below. The specific groups of products/MOSFET technologies are listed in the affected FSIDs list. Design,

die size and layout of the affected products will remain unchanged. There are no changes in the datasheet or electrical

performance.

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