Dual N-Channel, Digital FET
FDG6301N-F085
Features
• 25 V, 0.22 A Continuous, 0.65 A Peak
• R
• R
= 4 Ω @ V = 4.5 V,
DS(ON)
GS
= 5 Ω @ V = 2.7 V.
DS(ON)
GS
www.onsemi.com
• Very Low Level Gate Drive Requirements allowing Directop−
Eration in 3 V Circuits (V
< 1.5 V)
GS(th)
• Gate−Source Zener for ESD Ruggedness ( >6 kV Human Body
Model)
• Compact Industry Standard SC70−6 Surface Mount Package.
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
SC−88 (SC−70 6 Lead), 1.25x2
CASE 419AD
• Low Voltage Applications as a Replacement for Bipolar Digital
Transistors and Small Signal MOSFETs
MOSFET MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
Symbol
VDSS
VGS
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current Continuous
Pulsed
Ratings
25
Units
V
V
A
8
ID
0.22
0.65
0.3
PD
Power Dissipation
W
TJ, TSTG Operating and Storage Temperature
−55 to 150
6.0
°C
ESD
Electrostatic Discharge Rating
MIL−STD−883D Human Body Model
(100 pF / 1500 W)
kV
Thermal Resistance, Junction to Ambient
415
°C/W
R
q
JA
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. R
is the sum of the junction−to−case and case−to−ambient thermal
θ
JA
resistance, where the case thermal reference is defined as the Solder
mounting surface of the drain pins. R is guaranteed by design, while R
is determined by the board design. R
mounting on FR−4 board in still air.
θ
θ
JA
JC
= 415 °C/W on minimum pad
θ
JA
2. A suffix as “...F085P” has been temporarily introduced in order to manage a
double source strategy as ON Semiconductor has officially announced in
August 2014.
3. Pulse Test: Pulse Width < 300 ms, Duty Cycle < 2.0%
ORDERING INFORMATION
†
Device
Device Marking
Package
Shipping
FDG6301N−F085
FDG6301N
SC−88 (SC−70 6 Lead)
(Pb−Free, Halogen Free)
3,000 units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D
© Semiconductor Components Industries, LLC, 2019
1
Publication Order Number:
September, 2019 − Rev. 3
FDG6301N−F085/D