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FDD86381-F085 PDF预览

FDD86381-F085

更新时间: 2024-02-18 09:35:27
品牌 Logo 应用领域
安森美 - ONSEMI 开关晶体管
页数 文件大小 规格书
7页 536K
描述
N 沟道,PowerTrench® MOSFET,80 V,25 A,21 mΩ

FDD86381-F085 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:not_compliant
风险等级:1.51雪崩能效等级(Eas):14 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:80 V最大漏极电流 (ID):25 A
最大漏源导通电阻:0.021 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252JESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
参考标准:AEC-Q101表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDD86381-F085 数据手册

 浏览型号FDD86381-F085的Datasheet PDF文件第1页浏览型号FDD86381-F085的Datasheet PDF文件第3页浏览型号FDD86381-F085的Datasheet PDF文件第4页浏览型号FDD86381-F085的Datasheet PDF文件第5页浏览型号FDD86381-F085的Datasheet PDF文件第6页浏览型号FDD86381-F085的Datasheet PDF文件第7页 
FDD86381-F085  
®
N-Channel PowerTrench MOSFET  
80 V, 25 A, 21 mΩ  
Features  
„ Typical R  
= 16.2 mΩ at V = 10V, I = 25 A  
GS D  
DS(on)  
D
„ Typical Q  
= 14 nC at V = 10V, I = 25 A  
g(tot)  
GS  
D
„ UIS Capability  
„ RoHS Compliant  
„ Qualified to AEC Q101  
D
G
G
Applications  
S
„ Automotive Engine Control  
„ PowerTrain Management  
„ Solenoid and Motor Drivers  
„ Electronic Steering  
D-PAK  
(TO-252)  
S
„ Integrated Starter/Alternator  
„ Distributed Power Architectures and VRM  
„ Primary Switch for 12V Systems  
MOSFET Maximum Ratings TJ = 25°C unless otherwise noted.  
Symbol  
VDSS  
Parameter  
Ratings  
80  
Units  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
V
V
VGS  
±20  
Drain Current - Continuous (VGS=10) (Note 1)  
Pulsed Drain Current  
TC = 25°C  
TC = 25°C  
25  
ID  
A
See Figure 4  
EAS  
PD  
Single Pulse Avalanche Energy  
(Note 2)  
14  
48.4  
mJ  
W
W/oC  
oC  
oC/W  
oC/W  
Power Dissipation  
Derate Above 25oC  
0.323  
-55 to + 175  
3.1  
TJ, TSTG Operating and Storage Temperature  
RθJC  
RθJA  
Thermal Resistance, Junction to Case  
Maximum Thermal Resistance, Junction to Ambient  
(Note 3)  
52  
Notes:  
1: Current is limited by bondwire configuration.  
2: Starting T = 25°C, L = 70μH, I = 20A, V = 80V during inductor charging and V = 0V during time in avalanche.  
J
AS  
DD  
DD  
3: R  
is the sum of the junction-to-case and case-to-ambient thermal resistance, where the case thermal reference is defined as the solder  
θJA  
mounting surface of the drain pins. R  
presented here is based on mounting on a 1 in pad of 2oz copper.  
is guaranteed by design, while R  
is determined by the board design. The maximum rating  
θJC  
θJA  
2
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
FDD86381  
FDD86381-F085  
D-PAK(TO-252)  
13”  
16mm  
2500units  
©2016 Semiconductor Components Industries, LLC.  
August-2017 Rev. 2  
1
Publication Order Number:  
FDD86381-F085/D  

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