MOSFET – POWERTRENCH)
N-Channel
80 V, 240 A, 2.0 mW
FDBL86363-F085
Features
www.onsemi.com
• Typical R
• Typical Q
• UIS Capability
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
= 1.5 mꢀ at V = 10 V, I = 80 A
GS D
DS(on)
= 130 nC at V = 10 V, I = 80 A
g(tot)
GS
D
D
Applications
G
• Automotive Engine Control
• PowerTrain Management
• Solenoid and Motor Drivers
• Integrated Starter/Alternator
• Primary Switch for 12 V Systems
S
N−Channel
MOSFET MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Symbol
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage
Drain Current − Continuous
Ratings
80
Unit
V
V
DSS
V
A
V
GS
20
H−PSOF8L
CASE 100CU
I
D
240
(V = 10), T = 25°C (Note 1)
GS
C
See Figure 4
512
Pulsed Drain Current, T = 25°C
MARKING DIAGRAM
C
mJ
E
AS
Single Pulse Avalanche Energy
(Note 2)
W
P
357
2.38
Power Dissipation
D
$Y&Z&3&K
FDBL
86363
W/°C
°C
Derate Above 25°C
T , T
−55 to +175
0.42
Operating and Storage Temperature
Thermal Resistance, Junction to Case
J
STG
°C/W
°C/W
R
ꢁ
ꢁ
JC
R
43
Maximum Thermal Resistance,
Junction to Ambient (Note 3)
JA
$Y
&Z
&3
&K
= ON Semiconductor Logo
= Assembly Plant Code
= Numeric Date Code
= Lot Code
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Current is limited by silicon.
FDBL86363
= Specific Device Code
2. Starting T = 25°C, L = 0.25 mH, I = 64 A, V = 80 V during inductor
J
AS
DD
charging and V = 0 V during time in avalanche.
DD
3. R
is the sum of the junction−to−case and case−to−ambient thermal
ꢁ
JA
ORDERING INFORMATION
resistance, where the case thermal reference is defined as the solder
{
mounting surface of the drain pins. R
is guaranteed by design, while R
ꢁ
JA
Device
Top Mark
Package Shipping
ꢁ
JC
is determined by the board design. The maximum rating presented here is
FDBL86363 FDBL86363 H−PSOF8L 2000 Units/
2
based on mounting on a 1 in pad of 2oz copper.
−F085
Tape&Reel
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
January, 2020 − Rev. 3
FDBL86363−F085/D