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FDBL86363-F085 PDF预览

FDBL86363-F085

更新时间: 2024-09-14 11:12:27
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 512K
描述
80 V、240 A、2.0 mΩ、TO-LLN 沟道 PowerTrench®

FDBL86363-F085 数据手册

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MOSFET – POWERTRENCH)  
N-Channel  
80 V, 240 A, 2.0 mW  
FDBL86363-F085  
Features  
www.onsemi.com  
Typical R  
Typical Q  
UIS Capability  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree and are RoHS Compliant  
= 1.5 mat V = 10 V, I = 80 A  
GS D  
DS(on)  
= 130 nC at V = 10 V, I = 80 A  
g(tot)  
GS  
D
D
Applications  
G
Automotive Engine Control  
PowerTrain Management  
Solenoid and Motor Drivers  
Integrated Starter/Alternator  
Primary Switch for 12 V Systems  
S
NChannel  
MOSFET MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Symbol  
Parameter  
DraintoSource Voltage  
GatetoSource Voltage  
Drain Current Continuous  
Ratings  
80  
Unit  
V
V
DSS  
V
A
V
GS  
20  
HPSOF8L  
CASE 100CU  
I
D
240  
(V = 10), T = 25°C (Note 1)  
GS  
C
See Figure 4  
512  
Pulsed Drain Current, T = 25°C  
MARKING DIAGRAM  
C
mJ  
E
AS  
Single Pulse Avalanche Energy  
(Note 2)  
W
P
357  
2.38  
Power Dissipation  
D
$Y&Z&3&K  
FDBL  
86363  
W/°C  
°C  
Derate Above 25°C  
T , T  
55 to +175  
0.42  
Operating and Storage Temperature  
Thermal Resistance, Junction to Case  
J
STG  
°C/W  
°C/W  
R
JC  
R
43  
Maximum Thermal Resistance,  
Junction to Ambient (Note 3)  
JA  
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= Numeric Date Code  
= Lot Code  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Current is limited by silicon.  
FDBL86363  
= Specific Device Code  
2. Starting T = 25°C, L = 0.25 mH, I = 64 A, V = 80 V during inductor  
J
AS  
DD  
charging and V = 0 V during time in avalanche.  
DD  
3. R  
is the sum of the junctiontocase and casetoambient thermal  
JA  
ORDERING INFORMATION  
resistance, where the case thermal reference is defined as the solder  
{
mounting surface of the drain pins. R  
is guaranteed by design, while R  
JA  
Device  
Top Mark  
Package Shipping  
JC  
is determined by the board design. The maximum rating presented here is  
FDBL86363 FDBL86363 HPSOF8L 2000 Units/  
2
based on mounting on a 1 in pad of 2oz copper.  
F085  
Tape&Reel  
*For additional information on our PbFree strategy  
and soldering details, please download the  
ON Semiconductor Soldering and Mounting  
Techniques Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
January, 2020 Rev. 3  
FDBL86363F085/D  
 

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