Datasheet > FDBL9406-F085T6

FDBL9406-F085T6

更新时间： 2024-09-14 11:13:59

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
7页	517K
描述
Power MOSFET, Single N-Channel, TOLL, 40 V, 1.21 mΩ, 259 A

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FDBL9406-F085T6 数据手册

MOSFET - Power, Single

N-Channel, TOLL

40 V, 1.21 mW, 240 A

FDBL9406-F085T6

Features

• Low R

www.onsemi.com

to Minimize Conduction Losses

DS(on)

• Low Q and Capacitance to Minimize Driver Losses

• Lowers Switching Noise/EMI

MAX

I MAX

(BR)DSS

DS(ON)

• AEC−Q101 Qualified and PPAP Capable

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

40 V

1.21 mW @ 10 V

240 A

MAXIMUM RATINGS (T = 25°C unless otherwise noted)

D (9)

Parameter

Drain−to−Source Voltage

Symbol

Value

Unit

DSS

Gate−to−Source Voltage

+20/−16

240

Continuous Drain

= 25°C

= 100°C

= 25°C

G (1)

Current R

(Note 2)

179.4

136.4

68.2

Steady

State

Power Dissipation

(Note 2)

S (2 − 8)

= 100°C

Continuous Drain

Current R

T = 25°C

T = 100°C

31.8

4.3

(Notes 1, 2)

Steady

State

Power Dissipation

T = 25°C

(Notes 1, 2)

T = 100°C

2.1

Pulsed Drain Current

T = 25°C, t = 10 ms

2817

Operating Junction and Storage Temperature

Range

T , T

−55 to

+175

°C

stg

H−PSOF8L

CASE 100CU

Source Current (Body Diode)

221

271

Single Pulse Drain−to−Source Avalanche

Energy (I

= 42.5 A)

L(pk)

ORDERING INFORMATION

Lead Temperature Soldering Reflow for Solder-

ing Purposes (1/8″ from case for 10 s)

260

°C

†

Device

Package

Shipping

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

FDBL9406−F085T6 H−PSOF8L 2000 / Tape &

(Pb−Free) Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

THERMAL RESISTANCE MAXIMUM RATINGS

Parameter

Symbol

Value

1.1

Unit

Junction−to−Case − Steady State (Note 2)

Junction−to−Ambient − Steady State (Note 2)

°C/W

1. Surface−mounted on FR4 board using a 1 in pad size, 1 oz. Cu pad.

2. The entire application environment impacts the thermal resistance values shown,

they are not constants and are only valid for the particular conditions noted.

Publication Order Number:

June, 2020 − Rev. 0

FDBL9406−F085T6/D

12 3 4 5 6 7

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与FDBL9406-F085T6相关器件

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FDBL9406L-F085	ONSEMI	获取价格	汽车级 MOSFET，N 沟道，逻辑电平，40 V，240 A，1.1 mΩ
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