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FDBL9401-F085T6 PDF预览

FDBL9401-F085T6

更新时间: 2024-09-14 11:14:59
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 444K
描述
Power MOSFET, Single N-Channel, 40 V, 0.67 mΩ, 240 A

FDBL9401-F085T6 数据手册

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MOSFET - Power, Single  
N-Channel, TOLL  
40 V, 0.67 mW, 240 A  
FDBL9401-F085T6  
Features  
Low R  
to Minimize Conduction Losses  
Low Q and Capacitance to Minimize Driver Losses  
DS(on)  
www.onsemi.com  
G
AECQ101 Qualified and PPAP Capable  
Small Footprint (TOLL) for Compact Design  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
40 V  
0.67 mW @ 10 V  
240 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
D (9)  
V
DSS  
GatetoSource Voltage  
V
+20/16  
240  
V
GS  
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
A
C
D
q
JC  
G (1)  
T
C
240  
(Notes 1, 3)  
Steady  
State  
Power Dissipation  
T
C
P
180.7  
90.3  
58.4  
41.3  
4.3  
W
A
D
R
(Note 1)  
q
JC  
T
C
= 100°C  
S (2 8)  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
NCHANNEL MOSFET  
q
JA  
T = 100°C  
A
(Notes 1, 2, 3)  
Steady  
State  
Power Dissipation  
T = 25°C  
A
P
W
D
R
(Notes 1, 2)  
q
JA  
T = 100°C  
A
2.1  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
2758  
A
A
p
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
Source Current (Body Diode)  
I
138  
A
S
HPSOF8L  
CASE 100CU  
Single Pulse DraintoSource Avalanche  
E
AS  
1012  
mJ  
Energy (I  
= 45 A, L = 1 mH)  
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
ORDERING INFORMATION  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
Device  
Package  
Shipping  
FDBL9401F085T6 HPSOF8L 2000 / Tape &  
(PbFree) Reel  
THERMAL RESISTANCE MAXIMUM RATINGS  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Parameter  
Symbol  
Value  
0.83  
35  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
R
q
JA  
1. The entire application environment impacts the thermal resistance values  
shown, they are not constants and are only valid for the particular conditions  
noted. Current is limited by bondwire configuration.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
May, 2021 Rev. 2  
FDBL9401F085T6/D  
 

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