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FCD4B14CCB PDF预览

FCD4B14CCB

更新时间: 2024-11-01 22:15:51
品牌 Logo 应用领域
爱特美尔 - ATMEL 传感器
页数 文件大小 规格书
20页 255K
描述
Thermal Fingerprint Sensor with 0.4 mm x 14 mm Sensing Area and Digital Output

FCD4B14CCB 技术参数

生命周期:Transferred零件包装代码:COB
包装说明:DIE,针数:21
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.84模拟集成电路 - 其他类型:IMAGE SENSOR
JESD-30 代码:R-XUUC-N21功能数量:1
端子数量:21最高工作温度:70 °C
最低工作温度:封装主体材料:UNSPECIFIED
封装代码:DIE封装形状:RECTANGULAR
封装形式:UNCASED CHIP认证状态:Not Qualified
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:NO LEAD端子位置:UPPER

FCD4B14CCB 数据手册

 浏览型号FCD4B14CCB的Datasheet PDF文件第2页浏览型号FCD4B14CCB的Datasheet PDF文件第3页浏览型号FCD4B14CCB的Datasheet PDF文件第4页浏览型号FCD4B14CCB的Datasheet PDF文件第5页浏览型号FCD4B14CCB的Datasheet PDF文件第6页浏览型号FCD4B14CCB的Datasheet PDF文件第7页 
Features  
Sensitive Layer Over a 0.8 µm CMOS Array  
Image Zone: 0.4 x 14 mm = 0.02" x 0.55"  
Image Array: 8 x 280 = 2240 pixels  
Pixel Pitch: 50 µm x 50 µm = 500 dpi  
Pixel Clock: up to 2 MHz Enabling up to 1780 Frames per Second  
Die Size: 1.7 x 17.3 mm  
Operating Voltage: 3V to 5.5V  
Naturally Protected Against ESD: > 16 kV Air Discharge  
Power Consumption: 20 mW at 3.3V, 1 MHz, 25°C  
Operating Temperature Range: 0°C to +70°C: C suffix  
Resistant to Abrasion: >1 Million Finger Sweeps  
Chip-On-Board (COB) package or 20-lead Ceramic DIP available for development, with  
Specific Protective Layer  
Thermal  
Fingerprint  
Sensor with  
0.4 mm x 14 mm  
(0.02" x 0.55")  
Sensing Area  
and  
Applications  
PDA (Access Control, Data Protection)  
Cellular Phones, SmartPhone (Access e-business)  
Notebook, PC-add on (Access Control, e-business)  
PIN Code Replacement  
Automated Teller Machine, POS  
Building Access  
Electronic Keys (Cars, Home,...)  
Portable Fingerprint Imaging for Law Enforcement  
TV Access  
Digital Output  
(On-chip ADC)  
Figure 1. Fingerchip Packages  
Step for easy  
integration  
Chip-on-Board Package  
(COB)  
FCD4B14  
Sensing area  
FingerChip™  
Wire protection  
(not drawn)  
20-pin, 0.3" Dual-Inline  
Ceramic Package  
(DIP20)  
Rev. 1962C01/02  

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