32 Megabit FLASH EEPROM
DP5Z1MW32PV3
PRELIMINARY
DESCRIPTION:
The DP5Z1MW32PV3 ‘’VERSA-STACK’’ module is a revolutionary new
memory subsystem using Dense-Pac Microsystems’ ceramic Stackable
Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate. It
offers 32 Megabits of FLASH EEPROM in a single package envelope of 1.090"
x 1.090" x .163".
The DP5Z1MW32PV3 is built with 2 SLCC packages each containing a 1Meg
x 16 FLASH memory devices. Each SLCC is hermetically sealed making the
module suitable for commercial, industrial and military applications.
By using SLCCs, the ‘’Versa-Stack’’ family of modules offers a higher board
density of memory than available with conventional through-hole, surface
mount, module or hybrid techniques.
FEATURES:
• Organizations Available: 1 Meg x 32, 2 Meg x 16
PIN NAMES
A0 - A19
I/O0 - I/O31
CE0, CE1
WE
Address Inputs
Data Input/Output
Chip Enables
Write Enables
Output Enables
Power (+5 Volts)
Ground
Fast Access Times: 120, 150, 200ns (max.)
•
• Single 5.0 Volt
• High-Density Symmetrically Blocked Architecture
-
Sixteen 128 Kbyte Blocks Per Device
OE
• Extended Cycling Capability
100K Write/Erase Cycles
VDD
-
VSS
• Automated Erase and Program Cycles
N.C.
No Connect
-
-
Command User Interface
Status Register
• SRAM-Compatible Write Interface
• Hardware Data Protection Feature
FUNCTIONAL BLOCK DIAGRAM
-
Erase / Write Lockout during
Power Transitions
• 66 - Pin PGA ‘’VERSA-STACK’’ Package
PIN-OUT DIAGRAM
This document contains information on a product presently under
development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
30A180-11
Rev. C
1