Datasheet > CURNM101-HF

CURNM101-HF

更新时间： 2024-09-10 12:35:31

品牌	Logo	应用领域
上华 - COMCHIP		二极管快恢复二极管超快恢复二极管
页数	文件大小	规格书
4页	237K
描述
SMD Ultra Fast Recovery Rectifiers

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中文翻译

获取价格

数据手册

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CURNM101-HF 数据手册

SMD Ultra Fast Recovery Rectifiers

CURNM101-HF Thru. CURNM105-HF

Forward current: 1.0A

Reverse voltage: 200 to 1000V

RoHS Device

Halogen Free

1206-S/SOD-123

0.138 (3.50)

0.130 (3.30)

Features

- GPRC(Glass passivated rectifier chip) inside.

0.075 (1.90)

0.059 (1.50)

R 0.016 (0.40)

- Glass passivated cavity-free junction.

- Low power loss, High efficiency.

- High current capability

- Plastic package has underwriters laboratory

0.059(1.50)

Typ.

flammability classification 94V-0.

0.035 (0.90)

0.020 (0.50)

0.035 (0.90)

0.020 (0.50)

Mechanical Data

- Case: Packed with FRP substrate and

epoxy underfilled.

0.046 (1.16)

0.030 (0.76)

- Terminals: Pure Tin plated (Lead-Free), solderable

per MIL-STD-750, method 2026.

Dimensions in inches and (millimeter)

Circuit diagram

- Polarity: Cathode band laser marking.

- Weight: 0.012 gram (approx).

Absolute Maximum Ratings (at TA=25°C unless otherwise noted)

CURNM CURNM CURNM CURNM CURNM

101-HF 102-HF 103-HF 104-HF 105-HF

Parameter

Symbol

VRRM

Conditions

Unit

Repetitive peak reverse voltage

200

400

600

800

1000

1.0

Average forward current

Peak forward surge current

Reverse recovery time

8.3ms single half sine-wave

IF=0.5A,IR=1.0A,Irr=0.25A

IFSM

Trr

Operating junction temperature

range

-65 to +175

°C

Storage temperature range

TSTG

Electrical Characteristics (at TA=25°C unless otherwise noted)

Symbol

Type

Parameter

Conditions

MIN.

TYP.

MAX.

Unit

CURNM101-HF

CURNM102-HF

CURNM103-HF

CURNM104-HF

CURNM105-HF

0.95

1.10

1.50

1.00

1.25

1.70

Forward voltage

IF =1.0A

Repetitive peak reverse current

Junction capacitance

IRRM

VR =Max. VRRM, TA=25°C

VR=4V, f=1.0MHZ

0.10

Junction to ambient (Note)

Junction to lead (Note)

RθJA

RθJL

123

Thermal Resistance

°C/W

Notes: 1. Thermal resistance from junction to ambient and from junction to lead P.C.B. monuted on 0.2×0.2”(5.0*5.0mm) copper pad areas.

Company reserves the right to improve product design , functions and reliability without notice.

REV:A

Page 1

QW-JU006

Comchip Technology CO., LTD.

12 3 4

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