CSB10100CT-A
Super Low Barrier High Voltage Power Rectifier
Chip Integration Technology Corporation
Main Product Characteristics
■ Outline
2x5A
100V
150OC
0.62V
IF(AV)
VRRM
TJ
D2PAK(TO-263)
V(Typ)
0.411(10.45)
0.380(9.65)
0.055(1.40)
0.031(0.80)
0.190(4.83)
0.160(4.06)
0.055(1.40)
0.045(1.14)
0.245(6.22)
■ Features
MIN
• Low forward voltage drop.
2
• Excellent high temperature stability.
• Fast switching capability.
• Suffix "G" indicates Halogen-free part, ex.CSB10100CTG-A.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
0.370(9.40)
0.320(8.13)
Marking code
0~0.012(0~0.30)
1
3
0.110(2.79)
0.090(2.29)
0.228(5.80)
0.173(4.40)
0.063(1.60)
0.024(0.60)
■ Mechanical data
0.024(0.60)
0.011(0.28)
0.205(5.20)
0.189(4.80)
• Epoxy : UL94-V0 rated flame retardant.
• Case : Molded plastic, TO-263 / D2PAK
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
PIN 1
PIN 3
PIN 2
• Polarity: Indicated by cathode band.
• Mounting Position : Any.
Dimensions in inches and (millimeters)
• Weight : Approximated 1.70 gram.
■ Maximum ratings and electrical characteristics
Rating at 25OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Parameter
Marking code
Conditions
Symbol
CSB10100CT-A
CSB10100CT
UNIT
V
Peak repetitive reverse voltage
Working peak reverse voltage
DC blocking voltage
VRRM
VRWM
VRM
100
RMS reverse voltage
VR(RMS)
IO
71
10
V
A
Forward rectified current
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
Forward surge current
IFSM
120
A
OC/W
OC
RθJC
Thermal resistance(1)
Junction to case
4
Operating and Storage temperature
TJ, TSTG
-55 ~ +150
Parameter
Conditions
IF = 5A, TJ = 25OC
IF = 5A, TJ = 125OC
VR = VRRM TJ = 25OC
VR = VRRM TJ = 125OC
Symbol
VF
MIN.
TYP.
620
MAX.
UNIT
mV
800
710
0.2
25
Forward voltage drop
IR
Reverse current
mA
Note : 1.Thermal resistance from junction to case per leg, with heatsink size(1.35" x 0.95" x 0.18") Al-plate.
2.Device mounted on FR-4 substrate PC board, 1oz copper with minimum recommended pad layout.
3.Device mounted on Polymide substate, 1*MRP, 2oz, copper, PC boards.
Document ID : DS-12KDQ
Revised Date : 2015/08/11
Revision : C2
1