Datasheet > CP753V-CZT953-CT

CP753V-CZT953-CT

更新时间： 2024-10-01 14:48:35

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CP753V-CZT953-CT 技术参数

PROCESS CP753V

Small Signal Transistors

PNP - High Current Transistor Chip

PROCESS DETAILS

Process

EPITAXIAL PLANAR

66 x 66 MILS

7.1 MILS

Die Size

Die Thickness

Base Bonding Pad Area

Emitter 1 Bonding Pad Area

Emitter 2 Bonding Pad Area

Top Side Metalization

Back Side Metalization

7.9 x 7.9 MILS

7.9 x 9.5 MILS

Al-Si 30,000Å

12,000Å

GEOMETRY

GROSS DIER PER 5 INCH WAFER

3,878

PRINCIPAL DEVICE TYPES

CZT953

145 Adams Avenue

Hauppauge, NY 11788 USA

Tel: (631) 435-1110

Fax: (631) 435-1824

www.centralsemi.com

R1 (23-May 2007)

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