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CP775-CWDM3011P-WS PDF预览

CP775-CWDM3011P-WS

更新时间: 2024-11-19 21:14:31
品牌 Logo 应用领域
CENTRAL 开关脉冲晶体管
页数 文件大小 规格书
3页 716K
描述
Transistor

CP775-CWDM3011P-WS 技术参数

生命周期:Active包装说明:UNCASED CHIP, R-XUUC-N2
Reach Compliance Code:compliant风险等级:5.76
配置:SINGLE最小漏源击穿电压:30 V
最大漏极电流 (Abs) (ID):11 A最大漏极电流 (ID):11 A
最大漏源导通电阻:0.02 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-XUUC-N2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:UNCASED CHIP极性/信道类型:P-CHANNEL
最大脉冲漏极电流 (IDM):50 A子类别:Other Transistors
表面贴装:YES端子形式:NO LEAD
端子位置:UPPER晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

CP775-CWDM3011P-WS 数据手册

 浏览型号CP775-CWDM3011P-WS的Datasheet PDF文件第2页浏览型号CP775-CWDM3011P-WS的Datasheet PDF文件第3页 
CP775  
P-Channel MOSFET Die  
Enhancement-Mode  
www.centralsemi.com  
The CP775 medium power P-Channel MOSFET is designed for power management and load  
switching applications. The 7.5 mil thick die provides an ultra low profile device that is readily  
attached using standard die attach wire bond processes.  
APPLICATIONS:  
Load switching  
Power management  
DC-DC conversion  
FEATURES:  
Low on-resistance, r  
DS(ON)  
Low gate charge, Q  
gs  
High drain current density  
MECHANICAL SPECIFICATIONS:  
Die Size  
90 x 60 MILS  
Die Thickness  
7.5 MILS  
Gate Bonding Pad Area  
Source Bonding Pad Area  
Top Side Metalization  
Back Side Metalization  
Scribe Alley Width  
Wafer Diameter  
14.1 x 18.8 MILS  
52 x 88 MILS  
Al - 40,000Å  
Ti/Ni/Ag - 1,000Å/3,000Å/10,000Å  
3.15 MILS  
8 INCHES  
Gross Die Per Wafer  
8,000  
MAXIMUM RATINGS: (T =25°C)  
Drain-Source Voltage  
SYMBOL  
UNITS  
V
A
V
30  
DS  
Gate-Source Voltage  
V
20  
11  
V
GS  
Continuous Drain Current (Steady State)  
Maximum Pulsed Drain Current, tp=10μs  
Operating and Storage Junction Temperature  
I
A
D
I
50  
A
DM  
T , T  
-55 to +150  
°C  
J
stg  
ELECTRICAL CHARACTERISTICS: (T =25°C unless otherwise noted)  
A
SYMBOL  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
I
, I  
V
V
V
V
V
V
V
V
V
V
=20V, V =0  
100  
nA  
GSSF GSSR  
GS  
DS  
GS  
DS  
I
=30V, V =0  
GS  
1.0  
μA  
V
DSS  
BV  
=0, I =250μA  
30  
DSS  
GS(th)  
SD  
D
V
V
=V , I =250μA  
1.0  
1.4  
3.0  
1.3  
20  
V
GS DS  
D
=0, I =2.6A  
V
GS  
GS  
GS  
DS  
DS  
DS  
S
r
r
=10V, I =11A  
12  
15  
mΩ  
mΩ  
pF  
pF  
pF  
DS(ON)  
DS(ON)  
D
=4.5V, I =8.5A  
30  
D
C
C
C
=8.0V, V =0, f=1.0MHz  
450  
3100  
320  
rss  
iss  
GS  
=8.0V, V =0, f=1.0MHz  
GS  
=8.0V, V =0, f=1.0MHz  
oss  
GS  
R0 (8-August 2013)  

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