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CMT02N60XN252 PDF预览

CMT02N60XN252

更新时间: 2024-09-28 07:09:07
品牌 Logo 应用领域
虹冠电子 - CHAMP 晶体晶体管功率场效应晶体管
页数 文件大小 规格书
7页 236K
描述
POWER FIELD EFFECT TRANSISTOR

CMT02N60XN252 技术参数

生命周期:Contact Manufacturer包装说明:,
Reach Compliance Code:unknown风险等级:5.61
Is Samacsys:NBase Number Matches:1

CMT02N60XN252 数据手册

 浏览型号CMT02N60XN252的Datasheet PDF文件第2页浏览型号CMT02N60XN252的Datasheet PDF文件第3页浏览型号CMT02N60XN252的Datasheet PDF文件第4页浏览型号CMT02N60XN252的Datasheet PDF文件第5页浏览型号CMT02N60XN252的Datasheet PDF文件第6页浏览型号CMT02N60XN252的Datasheet PDF文件第7页 
CMT02N60  
POWER FIELD EFFECT TRANSISTOR  
GENERAL DESCRIPTION  
FEATURES  
This high voltage MOSFET uses an advanced termination  
scheme to provide enhanced voltage-blocking capability  
without degrading performance over time. In addition, this  
advanced MOSFET is designed to withstand high energy in  
avalanche and commutation modes. The new energy  
efficient design also offers a drain-to-source diode with a  
fast recovery time. Designed for high voltage, high speed  
switching applications in power supplies, converters and  
PWM motor controls, these devices are particularly well  
suited for bridge circuits where diode speed and  
commutating safe operating areas are critical and offer  
additional and safety margin against unexpected voltage  
transients.  
‹
‹
‹
Robust High Voltage Termination  
Avalanche Energy Specified  
Source-to-Drain Diode Recovery Time Comparable to a  
Discrete Fast Recovery Diode  
‹
‹
Diode is Characterized for Use in Bridge Circuits  
I
DSS and VDS(on) Specified at Elevated Temperature  
PIN CONFIGURATION  
SYMBOL  
TO-220/TO-220FP  
Front View  
TO-251  
Front View  
TO-252  
Front View  
N-Channel MOSFET  
D
G
S
2
3
1
2
3
1
ABSOLUTE MAXIMUM RATINGS  
Rating  
Drain to Current Continuous  
Pulsed  
Symbol  
ID  
Value  
2.0  
Unit  
A
IDM  
4.0  
Gate-to-Source Voltage Continue  
Non-repetitive  
VGS  
±20  
±40  
V
V
VGSM  
PD(Max)  
Total Power Dissipation  
TO-251  
30  
83  
W
TO-220  
TO-220FP  
30  
Operating and Storage Temperature Range  
Single Pulse Drain-to-Source Avalanche Energy TJ = 25℃  
(VDD = 100V, VGS = 10V, IL = 2A, L = 10mH, RG = 25)  
Thermal Resistance Junction to Case  
Junction to Ambient  
TJ, TSTG  
EAS  
-55 to 150  
20  
mJ  
θJC  
θJA  
TL  
1.0  
62.5  
260  
/W  
Maximum Lead Temperature for Soldering Purposes, 1/8” from case for 10 seconds  
2010/12/21 Rev. 1.5  
Champion Microelectronic Corporation  
Page 1  

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