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CMT04N60GN252 PDF预览

CMT04N60GN252

更新时间: 2024-11-21 07:09:07
品牌 Logo 应用领域
虹冠电子 - CHAMP /
页数 文件大小 规格书
8页 342K
描述
POWER MOSFET

CMT04N60GN252 技术参数

生命周期:Contact Manufacturer包装说明:,
Reach Compliance Code:unknown风险等级:5.61
Is Samacsys:NBase Number Matches:1

CMT04N60GN252 数据手册

 浏览型号CMT04N60GN252的Datasheet PDF文件第2页浏览型号CMT04N60GN252的Datasheet PDF文件第3页浏览型号CMT04N60GN252的Datasheet PDF文件第4页浏览型号CMT04N60GN252的Datasheet PDF文件第5页浏览型号CMT04N60GN252的Datasheet PDF文件第6页浏览型号CMT04N60GN252的Datasheet PDF文件第7页 
CMT04N60  
POWER MOSFET  
GENERAL DESCRIPTION  
FEATURES  
This advanced high voltage MOSFET is designed to  
withstand high energy in the avalanche mode and switch  
efficiently. This new high energy device also offers a  
drain-to-source diode with fast recovery time. Designed for  
high voltage, high speed switching applications such as  
power supplies, converters, power motor controls and  
bridge circuits.  
‹
‹
‹
‹
‹
‹
Higher Current Rating  
Lower Rds(on)  
Lower Capacitances  
Lower Total Gate Charge  
Tighter VSD Specifications  
Avalanche Energy Specified  
PIN CONFIGURATION  
SYMBOL  
D
TO-220/TO-220FP  
Front View  
TO-252  
Front View  
G
S
2
3
1
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS  
Rating  
Drain to Current Continuous  
Pulsed  
Symbol  
ID  
Value  
Unit  
4.0  
14  
A
IDM  
Gate-to-Source Voltage Continue  
Non-repetitive  
VGS  
VGSM  
PD  
±30  
±40  
V
V
Total Power Dissipation  
W
TO-220  
83  
30  
TO-220FP  
Operating and Storage Temperature Range  
Single Pulse Drain-to-Source Avalanche Energy TJ = 25℃  
TJ, TSTG  
EAS  
-55 to 150  
80  
mJ  
(VDD = 100V, VGS = 10V, IL = 4A, L = 10mH, RG = 25)  
Thermal Resistance Junction to Case  
Junction to Ambient  
/W  
θJC  
θJA  
TL  
1.30  
100  
260  
Maximum Lead Temperature for Soldering Purposes, 1/8” from case for 10 seconds  
2011/03/23 Rev. 1.5  
Champion Microelectronic Corporation  
Page 1  

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