Datasheet > CDDFN10_MDS

CDDFN10_MDS

更新时间： 2024-11-21 12:55:47

品牌	Logo	应用领域
伯恩斯 - BOURNS		二极管
页数	文件大小	规格书
1页	240K
描述
CDDFN10 Series Diode Products

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CDDFN10_MDS 数据手册

MATERIAL DECLARATION SHEET

Material Number

Product Line

CDDFN10 Series

Diode Products

1 July 2008

Yes

Compliance Date

RoHS Compliant

MSL

Homogeneous

Material\

Substances

Material

Mass % of

total unit wt.

Subpart

mass of total

wt. (%)

Construction

Element(subpart)

Homogeneous

Material

weight [g]

Materials

Mass %

CASRN

if applicable

No.

Die

Silicon Chip

Base Metal

Plating

Impurity

Gold Metal

Others

0.052

Doped Silicon

Copper

Iron

Phosphorus

Zinc

Nickel

Palladium

Gold

7440-21-3

744-50-8

7439-89-6

7723-14-0

7440-66-6

7440-02-0

744-05-3

7440-57-5

7439-92-1

7440-57-5

100

96.75

2.33

0.073

0.098

0.663

0.039

0.0095

0.03

1.707

39.39

0.95

0.03

0.04

1.707

Lead Frame

1.24

40.709

0.27

0.0160

.0039

0.0124

0.45

Lead

Gold

Others

Bond Wire

0.02

0.06

68.59

39.61

0.656

1.969

0.78

Die Attach

Adhesive

7440-22-4

Conductive Material

Silver

59.97

1.181

68928-70-1

29690-82-2

60676-86-0

1333-86-4

Filler

Hardener

Filler

Epoxy resin

Phenol resin

Silica

Carbon Black

Others

5.47

3.44

80.169

0.238

10.468

3.02

1.9

44.189

0.131

5.77

Mold Compound

1.68

55.12

Filler

Total weight

3.046

This Document was updated on: 18-march 2009

Important remarks:

1. It is the responsibility of the user to verify they are accessing the latest version.

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