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CDDFN6-0504P PDF预览

CDDFN6-0504P

更新时间: 2024-11-18 12:48:07
品牌 Logo 应用领域
伯恩斯 - BOURNS 二极管电视
页数 文件大小 规格书
4页 269K
描述
TVS/Steering Diode Array

CDDFN6-0504P 数据手册

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Features  
Applications  
Lead free as standard  
RoHS compliant*  
USB 2.0 & USB OTG  
Multimedia card interface  
SD card interface  
SIM ports  
Low capacitance - 1.2 pF  
No insertion loss to 2 GHz  
ESD, EFT, surge protection  
Gigabit Ethernet  
CDDFN6-0504P - TVS/Steering Diode Array  
General Information  
The CDDFN6-0504P device provides ESD, EFT and surge protection for high speed data  
ports meeting IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC 61000-4-5 (Surge)  
requirements. The Transient Voltage Suppressor array, protecting up to 4 data lines, offers a  
Working Peak Reverse Voltage of 5 V and Minimum Breakdown Voltage of 6 V.  
5
1
3
4
6
The molded packaged device will mount directly onto the industry standard DFN6 or QFN6  
footprint. Bourns® Chip Diodes are easy to handle with standard pick and place equipment  
and their flat configuration minimizes roll away.  
GND  
Absolute Maximum Ratings  
Parameter  
Symbol  
CDDFN6-0504P  
Unit  
W
Peak Pulse Power (t = 8/20 µs) (NOTE 1)  
p
Peak Pulse Current (t = 8/20 µs) (NOTE 1)  
p
P
150  
6.5  
pk  
I
A
PP  
Storage Temperature  
T
-55 to +150  
-55 to +125  
6
ºC  
ºC  
V
STG  
OPR  
Operating Temperature  
Operating Supply Voltage  
T
VDC  
ESD per IEC 61000-4-2 (Air)(I/O to GND)  
ESD per IEC 61000-4-2 (Contact) (I/O to GND)  
18  
14  
V
ESD_IO  
kV  
ESD per IEC 61000-4-2 (Air)(V  
ESD per IEC 61000-4-2 (Contact)(V  
to GND)  
30  
30  
CC  
V
kV  
V
ESD_VCC  
to GND)  
CC  
DC Voltage at any I/O Pin  
V
(GND-0.5) to (V +0.5)  
CC  
IO  
Note 1. See Power Derating Curve.  
Electrical Characteristics (@ T = 25 °C Unless Otherwise Noted)  
A
Parameter  
Symbol  
CDDFN6-0504P  
Unit  
1
Maximum Reverse Standoff Voltage  
1
V
5.0  
V
RWM  
Maximum Leakage Current @ V  
I
5.0  
1.0  
µA  
µA  
RWM  
D
Maximum Channel Leakage Current @ V  
I
CD  
RWM  
1
Minimum Reverse Breakdown Voltage  
@ I =1 mA  
V
6.0  
V
BR  
BV  
4
Maximum Forward Voltage @ I = 15 mA  
F
V
1.0  
8.1  
V
V
F
2
Typical Clamping Voltage  
V
C
Typical ESD Clamping Voltage -  
I/O per IEC 61000-4-2 +6 kV, Contact  
V
12.5  
9.0  
V
V
clamp_io  
2
1
Typical ESD Clamping Voltage-V  
V
clamp_VCC  
CC  
2
Maximum Channel Input Capacitance  
@ V =5 V, V =0 V, V =2.5 V, f=1 MHz  
C
1.6  
IN  
pF  
pF  
PIN5  
PIN2  
IN  
Maximum Channel to Channel Input  
3
C
Capacitance @ V  
=5 V, V  
=0 V,  
0.14  
PIN5  
PIN2  
CROSS  
V
=2.5 V, f=1 MHz  
IN  
Maximum Variation of Channel Input  
Capacitance @ V =5 V, V =0 V, V =2.5  
V, f=1 MHz. (I/O Pin to GND)  
ΔC  
0.06  
pF  
PIN2  
PIN5  
IN  
IN  
Note 1. Pin 5 to Pin 2 (ground).  
Note 2. Pin 1, 3, 4 or 6 to Pin 2 (ground).  
Note 3. Between any two of pins 1, 3, 4, 6.  
Note 4. Pin 2 (ground) to Pin 5.  
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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