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BUK583-60A PDF预览

BUK583-60A

更新时间: 2024-11-28 22:13:35
品牌 Logo 应用领域
恩智浦 - NXP 晶体晶体管功率场效应晶体管开关脉冲光电二极管
页数 文件大小 规格书
8页 57K
描述
PowerMOS transistor Logic level FET

BUK583-60A 技术参数

生命周期:Obsolete包装说明:SMALL OUTLINE, R-PDSO-G4
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.81
Is Samacsys:N外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (ID):3.2 A最大漏源导通电阻:0.1 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):160 pF
JESD-30 代码:R-PDSO-G4元件数量:1
端子数量:4工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):13 A
认证状态:Not Qualified表面贴装:YES
端子形式:GULL WING端子位置:DUAL
晶体管应用:SWITCHING晶体管元件材料:SILICON
最大关闭时间(toff):170 ns最大开启时间(吨):75 ns
Base Number Matches:1

BUK583-60A 数据手册

 浏览型号BUK583-60A的Datasheet PDF文件第2页浏览型号BUK583-60A的Datasheet PDF文件第3页浏览型号BUK583-60A的Datasheet PDF文件第4页浏览型号BUK583-60A的Datasheet PDF文件第5页浏览型号BUK583-60A的Datasheet PDF文件第6页浏览型号BUK583-60A的Datasheet PDF文件第7页 
Philips Semiconductors  
Product specification  
PowerMOS transistor  
Logic level FET  
BUK583-60A  
GENERAL DESCRIPTION  
QUICK REFERENCE DATA  
N-channel enhancement mode  
logic level field-effect power  
transistor in a plastic envelope  
suitable for surface mount  
applications.  
The device is intended for use in  
automotive and general purpose  
switching applications.  
SYMBOL  
PARAMETER  
MAX.  
UNIT  
VDS  
ID  
Drain-source voltage  
Drain current (DC)  
60  
3.2  
1.8  
150  
0.10  
V
A
W
˚C  
Ptot  
Tj  
Total power dissipation  
Junction temperature  
Drain-source on-state  
RDS(ON)  
resistance;  
VGS = 5 V  
PINNING - SOT223  
PIN CONFIGURATION  
SYMBOL  
PIN  
1
DESCRIPTION  
d
4
gate  
2
drain  
g
3
source  
4
drain (tab)  
2
3
1
s
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
SYMBOL PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VDS  
VDGR  
±VGS  
ID  
Drain-source voltage  
-
-
60  
60  
V
V
Drain-gate voltage  
RGS = 20 kΩ  
-
Gate-source voltage  
Drain current (DC)  
Drain current (DC)  
Drain current (pulse peak value)  
Total power dissipation  
Storage temperature  
Junction temperature  
-
-
15  
V
Tamb = 25 ˚C  
Tamb = 100 ˚C  
Tamb = 25 ˚C  
Tamb = 25 ˚C  
-
-
3.2  
2.0  
13  
1.8  
150  
150  
A
ID  
-
A
IDM  
Ptot  
Tstg  
Tj  
-
A
-
- 55  
-
W
˚C  
˚C  
-
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
Rth j-sp  
Rth j-amb  
From junction to solder point1  
From junction to ambient  
Mounted on any PCB  
Mounted on PCB of fig.18  
-
-
12  
-
15  
70  
K/W  
K/W  
1 Temperature measured at solder joint on drain tab.  
September 1995  
1
Rev 1.200  

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