BSS138W
50V N-Channel Enhancement Mode MOSFET - ESD Protected
Unit:inch(mm)
SOT-323
FEATURES
• RDS(ON), VGS@10V,IDS@500mA=3Ω
• RDS(ON), VGS@4.5V,IDS@200mA=4Ω
• RDS(ON), VGS@2.5V,IDS@100mA=6Ω
0.087(2.20)
0.070(1.80)
• Advanced Trench Process Technology
• High Density Cell Design For Ultra Low On-Resistance
• Very Low Leakage Current In Off Condition
• Specially Designed for Battery Operated Systems, Solid-State Relays
Drivers : Relays, Displays, Lamps, Solenoids, Memories, etc.
0.054(1.35)
0.045(1.15)
0.006(0.15)
0.002(0.05)
0.056(1.40)
0.047(1.20)
• ESD Protected
• Lead free in comply with EU RoHS 2002/95/EC directives.
• Green molding compound as per IEC61249 Std. . (Halogen Free)
0.004(0.10)MAX.
0.044(1.10)
0.035(0.90)
MECHANICAL DATA
• Case: SOT-323 Package
0.016(0.40)
0.008(0.20)
• Terminals : Solderable per MIL-STD-750,Method 2026
• Marking : 38W
• Apporx. Weight: 0.0002 ounces, 0.005 grams
Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted )
PARAMETER
Drain-Source Voltage
Symbol
VDS
Limit
Units
V
50
+20
300
2000
Gate-Source Voltage
VGS
ID
V
Continuous Drain Current
mA
mA
1)
Pulsed Drain Current
IDM
TA=25OC
TA=75OC
350
210
Maximum Power Dissipation
PD
mW
Operating Junction and Storage Temperature
Range
TJ,TSTG
RθJA
-55 to + 150
357
OC
Junction-to Ambient Thermal Resistance(PCB mounted)2
OC/W
Note: 1. Maximum DC current limited by the package
2. Surface mounted on FR4 board, t < 5 sec
PAN JIT RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,FUNCTIONS AND RELIABILITY WITHOUT NOTICE
November 09,2010-REV.01
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